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公开(公告)号：US20230027120A1
公开(公告)日：2023-01-26
申请号：US17411322
申请日：2021-08-25
发明人： Shao-Tzu Tang , Wen-Jung Tsai , Chih-Hsien Chiu , Ko-Wei Chang , Yu-Wei Yeh , Yu-Cheng Pai , Chuan-Yi Pan , Chi-Rui Wu
IPC分类号： H01Q1/22 , H01L23/552
摘要： An electronic package is provided, in which a carrier structure provided with electronic components is disposed onto an antenna structure, where a stepped portion is formed at an edge of the antenna structure, so that a shielding body is arranged along a surface of the stepped portion. Therefore, the shielding body only covers a part of the surface of the antenna structure to prevent the shielding body from interfering with operation of the antenna structure.
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公开(公告)号：US11984412B2
公开(公告)日：2024-05-14
申请号：US18097965
申请日：2023-01-17
发明人： Chih-Hsien Chiu , Ko-Wei Chang
CPC分类号： H01L23/645 , H01L21/4853 , H01L21/565 , H01L23/3128 , H01L23/49838 , H01L24/16 , H01L28/10 , H01L2224/16227 , H01L2924/19042 , H01L2924/19103
摘要： An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.
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公开(公告)号：US12068535B2
公开(公告)日：2024-08-20
申请号：US17748957
申请日：2022-05-19
发明人： Shao-Tzu Tang , Chih-Hsien Chiu , Wen-Jung Tsai , Ko-Wei Chang , Chia-Chu Lai
摘要： An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.
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公开(公告)号：US20240047440A1
公开(公告)日：2024-02-08
申请号：US17956653
申请日：2022-09-29
IPC分类号： H01L25/16 , H01L23/552 , H01L23/31 , H01L23/498 , H01L23/58 , H01L21/56
CPC分类号： H01L25/165 , H01L23/552 , H01L23/3121 , H01L23/49811 , H01L23/585 , H01L21/56
摘要： An electronic package is provided and includes at least one electronic element, at least one first conductive structure and a second conductive structure disposed on one side of a carrier structure with at least one circuit layer, and an encapsulation layer covering the electronic element, the first conductive structure and the second conductive structure, where the first conductive structure is exposed from the encapsulation layer to externally connect required elements according to functional requirements.
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公开(公告)号：US12057409B2
公开(公告)日：2024-08-06
申请号：US17571901
申请日：2022-01-10
发明人： Chih-Hsien Chiu , Wen-Jung Tsai , Chien-Cheng Lin , Ko-Wei Chang , Yu-Wei Yeh , Shun-Yu Chien , Chia-Yang Chen
IPC分类号： H01L23/00 , H01L23/16 , H01L23/31 , H01L23/498 , H01L23/58
CPC分类号： H01L23/562 , H01L23/3121 , H01L23/49822
摘要： An electronic package and a manufacturing method of the electronic package are provided, in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure nor cover the electronic component is embedded in the packaging layer.
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公开(公告)号：US11587892B2
公开(公告)日：2023-02-21
申请号：US17159527
申请日：2021-01-27
发明人： Chih-Hsien Chiu , Ko-Wei Chang
IPC分类号： H01L25/065 , H01L23/64 , H01L23/00 , H01L23/31 , H01L23/498 , H01L21/48 , H01L21/56 , H01L49/02
摘要： An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.
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7.发明公开公开(公告)号：US20230282972A1
公开(公告)日：2023-09-07
申请号：US17748957
申请日：2022-05-19
发明人： Shao-Tzu Tang , Chih-Hsien Chiu , Wen-Jung Tsai , Ko-Wei Chang , Chia-Chu LAI
摘要： An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.
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公开(公告)号：US20230223322A1
公开(公告)日：2023-07-13
申请号：US17574944
申请日：2022-01-13
发明人： Chih-Hsien Chiu , Ko-Wei Chang , Wen-Jung Tsai , Che-Wei Yu , Chia-Yang Chen
IPC分类号： H01L23/498 , H01L23/31 , H01L23/00 , H01L21/48 , H01L25/065 , H01L25/00
CPC分类号： H01L23/49816 , H01L23/3121 , H01L24/16 , H01L21/4853 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/16227 , H01L2924/3511 , H01L24/73 , H01L2224/73204 , H01L24/32 , H01L2224/32225 , H01L25/0652 , H01L2225/06517
摘要： Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.
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公开(公告)号：US20230163082A1
公开(公告)日：2023-05-25
申请号：US17571901
申请日：2022-01-10
发明人： Chih-Hsien Chiu , Wen-Jung Tsai , Chien-Cheng Lin , Ko-Wei Chang , Yu-Wei Yeh , Shun-Yu Chien , Chia-Yang Chen
IPC分类号： H01L23/00 , H01L23/498 , H01L23/31
CPC分类号： H01L23/562 , H01L23/49822 , H01L23/3121
摘要： An electronic package is provided in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure is embedded in the packaging layer. Therefore, thermal stress is dispersed through the frame body to avoid warpage of the electronic package, so as to facilitate the arrangement of other electronic components around the electronic component.
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