- 专利标题： Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof
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申请号： US17748957申请日： 2022-05-19
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公开(公告)号： US12068535B2公开(公告)日： 2024-08-20
- 发明人: Shao-Tzu Tang , Chih-Hsien Chiu , Wen-Jung Tsai , Ko-Wei Chang , Chia-Chu Lai
- 申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 申请人地址： TW Taichung
- 专利权人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人地址： TW Taichung
- 代理机构： Studebaker & Brackett PC
- 优先权： TW 1108211 2022.03.07
- 主分类号： H01Q1/48
- IPC分类号： H01Q1/48 ; H01Q1/38 ; H01Q1/50
摘要：
An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.
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