Multi-chip module (MCM) assembly
    1.
    发明授权

    公开(公告)号:US11584126B2

    公开(公告)日:2023-02-21

    申请号:US17265144

    申请日:2019-07-15

    Abstract: A multi-chip module (MCM) assembly comprising: a graphite substrate having a front surface and a back surface and comprising a plurality of silicon chips mounted on the front surface, a Printed Wiring Board (PWB) attached to the graphite substrate and provided with openings surrounding outer profiles of the silicon chips, the graphite substrate comprises one or more ink channels on the back surface and one or more ink feeding slots passing through the graphite substrate and being in fluidic communication with the respective one or more ink channels, so that each of the silicon chips can be fed with one or more different types of inks, the MCM assembly further comprises a graphite cover plate configured to cover the one or more ink channels of the graphite substrate.

    Multi-chip module (MCM) assembly and a printing bar

    公开(公告)号:US11571894B2

    公开(公告)日:2023-02-07

    申请号:US17265039

    申请日:2019-07-18

    Abstract: A multi-chip module (MCM) assembly comprising: a graphite substrate comprising a plurality of silicon chips directly attached to the graphite substrate, and a Printed Wiring Board (PWB) attached to the graphite substrate by means of a solvent-resistant adhesive glue and provided with openings surrounding outer profiles of the silicon chips. A printing bar comprising a plurality of the MCM assemblies is also disclosed.

    Continuously refillable ink-jet cartridge

    公开(公告)号:US10265963B2

    公开(公告)日:2019-04-23

    申请号:US15741215

    申请日:2016-09-12

    Abstract: The present application relates to a continuously refillable ink-jet cartridge comprising a housing (2) having a bottom, a circumferential wall and a top, a backpressure element (3) contained in the housing (2), and a pipe (27) configured to inject ink through a mouth (28) into the housing (2). According to the present invention, the mouth (28) of the pipe (27) is located and configured such that it is at least partially surrounded by the backpressure element (3).

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