Multi-chip module (MCM) assembly
    1.
    发明授权

    公开(公告)号:US11584126B2

    公开(公告)日:2023-02-21

    申请号:US17265144

    申请日:2019-07-15

    Abstract: A multi-chip module (MCM) assembly comprising: a graphite substrate having a front surface and a back surface and comprising a plurality of silicon chips mounted on the front surface, a Printed Wiring Board (PWB) attached to the graphite substrate and provided with openings surrounding outer profiles of the silicon chips, the graphite substrate comprises one or more ink channels on the back surface and one or more ink feeding slots passing through the graphite substrate and being in fluidic communication with the respective one or more ink channels, so that each of the silicon chips can be fed with one or more different types of inks, the MCM assembly further comprises a graphite cover plate configured to cover the one or more ink channels of the graphite substrate.

    Modular service station and a method of servicing an inkjet printhead of an inkjet printing system

    公开(公告)号:US11491792B2

    公开(公告)日:2022-11-08

    申请号:US17265069

    申请日:2019-07-18

    Inventor: Paolo Cappello

    Abstract: A modular service station for servicing at least one inkjet printhead of an inkjet printing system, the service station comprising: a frame with mounted thereon at least one capping element and at least one wiping element, a means for horizontal movement of the at least one inkjet printhead between a printing position and a servicing position, the means for horizontal movement configured to enable a wiping process, a means for vertical movement of the at least one inkjet printhead, the means for vertical movement configured to enable capping, unclogging or purging processes in respect to the at least one inkjet printhead, and a waste ink tank in hermetic communication with the at least one capping element. A method of servicing an inkjet printhead of an inkjet printing system is also disclosed.

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