公开(公告)号：US20240228773A1

公开(公告)日：2024-07-11

申请号：US18562894

申请日：2022-05-27

Applicant: SHPP GLOBAL TECHNOLOGIES B.V.

Inventor： Xiaoming JIANG ,  Yun ZHENG ,  Yunan CHENG

IPC: C08L69/00 ,  C08G81/00 ,  C08K5/521 ,  C08L67/02

CPC classification number: C08L69/00 ,  C08G81/00 ,  C08K5/521 ,  C08L67/02 ,  C08L2205/03

Abstract: Disclosed herein are polymer compositions comprising: from about 0.1 wt. % to about 99 wt. % of a polycarbonate copolymer, homopolymer or a blend thereof; from about 0.1 wt. % to about 70 wt. % of a crystalline polyester; from about 0.1 wt. % to about 50 wt. % of an inherently dissipative polymer; and from about 0.001 wt. % to about 10 wt. % of a transesterification inhibitor, wherein the combined weight percent value of all components does not exceed about 100 wt. %, and all weight percent values are based on the total weight of the polymer composition. The polymer composition may exhibit surface resistivity less than 1×109 Ohms when measured in accordance with ASTM D257.

公开(公告)号：US20230117110A1

公开(公告)日：2023-04-20

申请号：US17800676

申请日：2021-02-11

Applicant: SHPP GLOBAL TECHNOLOGIES B.V.

Inventor： Yunan CHENG ,  Yun ZHENG

IPC: C08K13/06 ,  C08K7/06 ,  C08K7/14 ,  C08K3/013 ,  C08K3/38 ,  C08K3/22 ,  C08K9/02 ,  H05K1/03

Abstract: A thermoplastic composition includes: (a) poly(cyclohexylenedimethylene terephthalate) (PCT) or a copolymer thereof; (b) at least 10 wt % of a reinforcing filler comprising glass fiber; (c) a laser direct structuring (LDS) additive comprising a tin oxide, an antimony oxide, or a combination thereof; and (d) a reflection additive comprising a titanium compound. A weight ratio of total titanium in the composition to the LDS additive in the composition is at least 0.7:1, or a weight ratio of total titanium in the composition to the PCT is 1.1:1 or less.

公开(公告)号：US20230340226A1

公开(公告)日：2023-10-26

申请号：US17800610

申请日：2021-02-16

Applicant: SHPP GLOBAL TECHNOLOGIES B.V.

Inventor： Yunan CHENG ,  Yun ZHENG

IPC: C08K3/22 ,  C08K7/28 ,  H05K3/18 ,  H05K3/10 ,  H05K1/16

CPC classification number: C08K3/22 ,  C08K7/28 ,  H05K3/182 ,  H05K3/105 ,  H05K1/165 ,  C08K2003/2231 ,  C08K3/2279 ,  H05K2203/107 ,  H05K2201/10098 ,  H05K2203/1136 ,  H05K2201/0129

Abstract: Disclosed is a composition comprising: from about 10 wt. % to about 90 wt. % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyphenylene sulfide resin; from about 0.01 to 10 wt. % of a laser direct structuring additive; from about 0.01 wt. % to about 50 wt. % of laser breakable filler, wherein the composition exhibits a dissipation factor of less than 0.01 at frequencies of 1 GHz to 20 GHz frequencies when measured using a dielectric resonator, and wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition.