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公开(公告)号：US10734217B2
公开(公告)日：2020-08-04
申请号：US15671529
申请日：2017-08-08
摘要： A substrate treatment device according to an embodiment includes a placement portion on which a substrate is placed and rotated, a liquid supply portion which supplies a liquid to a surface on an opposite side to the placement portion of the substrate, a cooling portion which supplies a cooling gas to a surface on a side of the placement portion of the substrate, and a control portion which controls at least one of a rotation speed of the substrate, a supply amount of the liquid, and a flow rate of the cooling gas. The control portion brings the liquid present on a surface of the substrate into a supercooled state and causes at least a part of the liquid brought into the supercooled state to freeze.
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公开(公告)号：US12109597B2
公开(公告)日：2024-10-08
申请号：US17230152
申请日：2021-04-14
CPC分类号： B08B7/0014 , B08B3/041 , B08B3/08 , B08B3/10 , F25C1/12 , H01L21/67028
摘要： According to one embodiment, a substrate treatment device includes a placement stand configured to rotate the substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a first liquid supplier configured to supply a first liquid on a surface of the substrate, a second liquid supplier configured to supply a second liquid on the surface, and a controller controlling rotation of the substrate, supply of the cooling gas, the first and second liquids. The controller performs a preliminary process of supplying the second liquid on the surface, and supplying the cooling gas into the space, a liquid film forming process by supplying the first liquid toward the surface after the preliminary process, a supercooling process of the liquid film on the surface, and a freezing process of at least a part of the liquid film on the surface.
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公开(公告)号：US11355337B2
公开(公告)日：2022-06-07
申请号：US16916288
申请日：2020-06-30
摘要： A substrate treatment device according to an embodiment includes a placement portion on which a substrate is placed and rotated, a liquid supply portion which supplies a liquid to a surface on an opposite side to the placement portion of the substrate, a cooling portion which supplies a cooling gas to a surface on a side of the placement portion of the substrate, and a control portion which controls at least one of a rotation speed of the substrate, a supply amount of the liquid, and a flow rate of the cooling gas. The control portion brings the liquid present on a surface of the substrate into a supercooled state and causes at least a part of the liquid brought into the supercooled state to freeze.
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公开(公告)号：US20200335324A1
公开(公告)日：2020-10-22
申请号：US16916288
申请日：2020-06-30
摘要： A substrate treatment device according to an embodiment includes a placement portion on which a substrate is placed and rotated, a liquid supply portion which supplies a liquid to a surface on an opposite side to the placement portion of the substrate, a cooling portion which supplies a cooling gas to a surface on a side of the placement portion of the substrate, and a control portion which controls at least one of a rotation speed of the substrate, a supply amount of the liquid, and a flow rate of the cooling gas. The control portion brings the liquid present on a surface of the substrate into a supercooled state and causes at least a part of the liquid brought into the supercooled state to freeze.
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公开(公告)号：US12005482B2
公开(公告)日：2024-06-11
申请号：US17195924
申请日：2021-03-09
CPC分类号： B08B7/0092 , B08B3/10 , H01L21/67051
摘要： According to one embodiment, q substrate treatment device includes a placement stand, a plurality of support portions, a cooling part, a liquid supplier, and at least one protrusion. The placement stand has a plate shape, and is configured to rotate. The support portions are provided on one surface of the placement stand and configured to support a substrate. The cooling part is configured to supply a cooling gas into a space between the placement stand and a back surface of the substrate supported by the support portions. The liquid supplier is configured to supply a liquid onto a surface of the substrate. At least one protrusion is provided on the one surface of the placement stand and extends along a boundary line of a region where the substrate is provided in a plan view.
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公开(公告)号：US11784040B2
公开(公告)日：2023-10-10
申请号：US17181264
申请日：2021-02-22
CPC分类号： H01L21/02057 , B08B7/0092 , H01L21/02052 , H01L21/67023
摘要： According to one embodiment, a substrate treatment device includes a placement stand configured to rotate a substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a liquid supplier configured to supply a liquid on a surface of the substrate opposite to the placement stand, and a controller controlling a rotation speed of the substrate, a flow rate of the cooling gas, or a supply amount of the liquid. The controller sets the liquid on the surface of the substrate to be in a supercooled state, forms a frozen film by freezing the liquid in the super cooled state, and causes crack to generate in the frozen film by decreasing a temperature of the frozen film.
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公开(公告)号：US12097541B2
公开(公告)日：2024-09-24
申请号：US17469876
申请日：2021-09-09
IPC分类号： B08B3/10 , B08B3/04 , B08B7/00 , B08B13/00 , H01L21/687
CPC分类号： B08B3/10 , B08B3/041 , B08B7/0092 , B08B13/00 , H01L21/6875
摘要： A substrate processing apparatus according to an embodiment of the present disclosure includes a stage having a substantially disc-shaped form and including a hole in a center thereof; a roller that contacts a side surface of the stage and rotates the stage; a first liquid nozzle that supplies a first liquid to a first surface of the substrate; a first driver that moves a position of the first liquid nozzle; a second liquid nozzle that supplies a second liquid from the hole of the stage to a second surface of the substrate; a second driver that moves a position of the second liquid nozzle; a cooling nozzle that supplies a cooling gas from the hole of the stage to the second surface; a third driver that moves a position of the cooling nozzle; and a controller that controls the first driver, the second driver, and the third driver.
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公开(公告)号：US12074055B2
公开(公告)日：2024-08-27
申请号：US17665657
申请日：2022-02-07
发明人： Masaya Kamiya , Kensuke Demura
IPC分类号： H01L21/687 , H01L21/67
CPC分类号： H01L21/68764 , H01L21/67051 , H01L21/67248
摘要： A substrate treatment device according to an embodiment includes a placement part that includes a placement platform on which a substrate is placeable and that is configured to rotate the placed substrate, a cooling nozzle configured to supply a cooling gas to a space between the placement platform and the substrate, a liquid supplier configured to supply a liquid to a surface of the substrate opposite to the placement platform side, and a dispersion plate located at a discharge side of the cooling gas of the cooling nozzle. The dispersion plate includes a first hole extending through the dispersion plate in a thickness direction. The first hole is located at a position overlapping a central axis of the cooling nozzle when viewed along a direction along the central axis of the cooling nozzle.
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公开(公告)号：US20180047559A1
公开(公告)日：2018-02-15
申请号：US15671529
申请日：2017-08-08
CPC分类号： H01L21/02052 , B08B3/10 , B08B7/0092 , G03F7/40 , G03F7/422 , H01L21/02057 , H01L21/67051 , H01L21/67109 , H01L21/67248 , H01L21/67253 , H01L21/68764 , H01L22/12
摘要： A substrate treatment device according to an embodiment includes a placement portion on which a substrate is placed and rotated, a liquid supply portion which supplies a liquid to a surface on an opposite side to the placement portion of the substrate, a cooling portion which supplies a cooling gas to a surface on a side of the placement portion of the substrate, and a control portion which controls at least one of a rotation speed of the substrate, a supply amount of the liquid, and a flow rate of the cooling gas. The control portion brings the liquid present on a surface of the substrate into a supercooled state and causes at least a part of the liquid brought into the supercooled state to freeze.
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