RANDOM ACCESS MEMORY AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20240349512A1

    公开(公告)日:2024-10-17

    申请号:US18635072

    申请日:2024-04-15

    IPC分类号: H10B53/30

    CPC分类号: H10B53/30

    摘要: A memory using ferroelectric metal field-effect transistors includes a drain, a source, and a gate formed on a substrate, a gate contact formed on an upper portion of the gate, and a ferroelectric layer disposed between the gate contact and the gate and configured to surround the gate contact, wherein the gate, the ferroelectric layer, and the gate contact operate as a capacitor having a metal-ferroelectric layer-metal (MFM) structure.

    RANDOM ACCESS MEMORY AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20240349477A1

    公开(公告)日:2024-10-17

    申请号:US18635211

    申请日:2024-04-15

    IPC分类号: H10B12/00

    CPC分类号: H10B12/00

    摘要: A random access memory includes a first transistor including a first gate extending in a first direction, a second transistor including a second gate extending in a second direction perpendicular to the first direction and formed on an upper portion of the first transistor, and a storage node configured to connect a first gate of the first transistor to a drain of the second transistor and storing data.