公开(公告)号：US20240363575A1

公开(公告)日：2024-10-31

申请号：US18480897

申请日：2023-10-04

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Jihwan KIM ,  Seungwon IM ,  Oseob JEON ,  Hangil SHIN ,  Taekyun KIM

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L25/07 ,  H01L25/11

CPC分类号： H01L24/24 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/49861 ,  H01L24/82 ,  H01L25/072 ,  H01L25/115 ,  H01L23/4924 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/32 ,  H01L24/73 ,  H01L24/96 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82002 ,  H01L2224/82106 ,  H01L2224/96 ,  H01L2924/13055 ,  H01L2924/13091

摘要： A fan out package may include a plurality of semiconductor dies, each of the semiconductor dies including a first surface and a second surface opposite to the first surface. The fan out package includes a redistribution layer coupled to the first surface of each of the plurality of semiconductor dies, a dieback conductive member coupled to the second surface of each of the plurality of semiconductors dies, and an encapsulation material coupled to the plurality of semiconductor dies and the dieback conductive member.