公开(公告)号：US20180114773A1

公开(公告)日：2018-04-26

申请号：US15704984

申请日：2017-09-14

申请人： SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD

发明人： Chin Tien Chiu ,  Tiger Tai ,  Ken Qian ,  CC Liao ,  Hem Takiar ,  Gursharan Singh

IPC分类号： H01L25/065 ,  H01L25/00

CPC分类号： H01L25/0652 ,  H01L24/05 ,  H01L24/16 ,  H01L24/24 ,  H01L24/25 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/14131 ,  H01L2224/16137 ,  H01L2224/16145 ,  H01L2224/24051 ,  H01L2224/24105 ,  H01L2224/24147 ,  H01L2224/244 ,  H01L2224/245 ,  H01L2224/2512 ,  H01L2224/25175 ,  H01L2224/2518 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/73207 ,  H01L2224/73209 ,  H01L2224/73227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73267 ,  H01L2224/82051 ,  H01L2224/82106 ,  H01L2224/82948 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/00012 ,  H01L2924/00014

摘要： The present technology relates to a semiconductor package. The semiconductor package comprises: a first component comprising a plurality of first dies stacked on top of each other, each of first dies comprising at least one side surface and an electrical contact exposed on the side surface, and the plurality of first dies aligned so that the corresponding side surfaces of all first dies substantially coplanar with respect to each other to form a common sidewall; a first conductive pattern formed over the sidewall and at least partially spaced away from the sidewall, the first conductive pattern electrically interconnecting the electrical contacts of the plurality of first dies; at least one second component; and a second conductive pattern formed on a surface of the second component, the second conductive pattern affixed and electrically connected to the first conductive pattern formed over the sidewall of the first component.

公开(公告)号：US11031371B2

公开(公告)日：2021-06-08

申请号：US15704984

申请日：2017-09-14

申请人： SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.

发明人： Chin Tien Chiu ,  Tiger Tai ,  Ken Qian ,  C C Liao ,  Hem Takiar ,  Gursharan Singh

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L25/18 ,  H01L25/00

摘要： The present technology relates to a semiconductor package. The semiconductor package comprises: a first component comprising a plurality of first dies stacked on top of each other, each of first dies comprising at least one side surface and an electrical contact exposed on the side surface, and the plurality of first dies aligned so that the corresponding side surfaces of all first dies substantially coplanar with respect to each other to form a common sidewall; a first conductive pattern formed over the sidewall and at least partially spaced away from the sidewall, the first conductive pattern electrically interconnecting the electrical contacts of the plurality of first dies; at least one second component; and a second conductive pattern formed on a surface of the second component, the second conductive pattern affixed and electrically connected to the first conductive pattern formed over the sidewall of the first component.