-
公开(公告)号:US11800688B2
公开(公告)日:2023-10-24
申请号:US17289285
申请日:2019-11-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Haein Chung , Kyungha Koo , Seungjae Bae , Hyunjoong Yoon , Jaeho Chung , Yongwon Cho
CPC classification number: H05K7/20509 , G06F1/203 , H05K7/20336
Abstract: An embodiment of the present invention discloses a heat dissipation structure and an electronic device including the heat dissipation structure, the heat dissipation structure comprising: at least one heat dissipation plate; at least one rigid plate which forms an opening in one area and is coupled to the upper portion of the at least one heat dissipation plate to support durability of the at least one heat dissipation plate; at least one heat pipe of which at least a portion is accommodated in the opening formed by the at least one rigid plate and is coupled to an area of the at least one heat dissipation plate that faces the at least one heat pipe; and at least one fixing tool which supports the fixing between the at least one heat dissipation plate and the at least one rigid plate. In addition, various embodiments identified through the specification are possible.
-
公开(公告)号:US20210376453A1
公开(公告)日:2021-12-02
申请号:US17333243
申请日:2021-05-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junhee HAN , Heedong Kim , Inho Shin , Jiyoung Lim , Yongwon Cho , Jiwoo Lee
IPC: H01Q1/24 , H04M1/02 , G06F3/0354 , H01Q21/06 , H01Q1/02
Abstract: An electronic device including antennas is provided. The electronic device includes a cover window including a view area and a non-view area formed along edges of the view area and including a view portion formed in at least one area, a frame including a first structure and a second structure which at least one electronic component is disposed, one surface of the first structure, forming the rear surface of the electronic device, including a nonconductive area including a window area and a conductive area surrounding the nonconductive area, a display, a PCB disposed in the second structure, wireless communication circuitry disposed on the printed circuit board, a first camera disposed in an area corresponding to the view portion of the second structure, a second camera disposed in an area of the second structure corresponding to the window area, a first antenna module configured to generate a first RF signal toward the cover window, and a second antenna module configured to generate a second RF signal toward the rear surface of the electronic device.
-
公开(公告)号:US11016904B2
公开(公告)日:2021-05-25
申请号:US16543531
申请日:2019-08-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yongwon Cho , Hyeonwu Kim , Seok-Won Ahn
IPC: G06F12/00 , G06F12/1009
Abstract: A storage device includes a controller and a memory. In response to a request of a host, the controller generates: (A) a first list as a result of counting: (1) the number of first page numbers included in a first range among page numbers included in a logical address received from the host and (2) the number of second page numbers included in a second range not overlapping the first range, (B) generates a second list as a result of respectively grouping the first page numbers and the second page numbers based on the first list, and (C) translates the logical address to a physical address based on the second list and the first map data. The memory stores the first map data to be provided to the controller. The first map data matches the first page numbers and the second page numbers with respective physical addresses.
-
4.
公开(公告)号:US09043677B2
公开(公告)日:2015-05-26
申请号:US14194993
申请日:2014-03-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: JaePhil Kong , Yongwon Cho , Jong-Uk Song
CPC classification number: G06F11/076 , G06F11/1048 , H03M13/152 , H03M13/1545 , H03M13/1555 , H03M13/3715 , H03M13/6502
Abstract: A method of operating a memory controller to control a memory device includes reading a read vector from the memory device and correcting one or more errors in the read vector, where a power consumed at the correcting is varied according to the number of errors in the read vector.
Abstract translation: 操作存储器控制器以控制存储器件的方法包括从存储器件读取读取向量并校正读取向量中的一个或多个错误,其中校正时消耗的功率根据读取的错误数量而变化 向量。
-
公开(公告)号:US11955691B2
公开(公告)日:2024-04-09
申请号:US17702875
申请日:2022-03-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: Taekwan Cha , Yongwon Cho
CPC classification number: H01Q1/2266 , H01Q1/48
Abstract: An electronic device according to an embodiment of the disclosure may be configured to include a housing including a conductive plate and a non-conductive plate, a reinforcing member disposed at a first part inside the housing and including a groove of a predetermined length, a printed circuit board disposed at a second part different from the first part inside the housing, an antenna module disposed at one surface of the reinforcing member and including a ground layer at the rear surface thereof, and a signal connection member configured to electrically connect the printed circuit board and the antenna module, wherein a part of the signal connection member extends through the groove and is electrically connected to a first area of the ground layer in the groove by using a solder. Other various embodiments are possible.
-
公开(公告)号:US20230118000A1
公开(公告)日:2023-04-20
申请号:US17970242
申请日:2022-10-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sungyong Lim , Sungyeol Kim , Yongwon Cho , Younghwan Choi , Chunyoon Park , Seungbo Shim , Hyungjung Yong , Jaejoong Lee
IPC: H01J37/32
Abstract: A radio frequency (RF) generating device for generating RF output signals is provided. The RF generating device includes: a controller configured to generate an RF control signal and a gain control signal; a plurality of RF signal generators, each RF signal generator being configured to generate an RF signal having at least one of a frequency and a phase determined based on the RF control signal; a plurality of RF amplification modules, each RF amplification module being configured to receive the RF signal generated by a corresponding RF signal generator and generate an RF amplification signal by controlling a gain of the RF signal based on the gain control signal; an RF switch module configured to select at least one of the RF amplification signals generated by the RF amplification modules and generate an RF output signal in a form of a multi-level pulse based on the selected at least one of the RF amplification signals; and an impedance converter connected to an electrode of an external load and configured to convert a load impedance into a target impedance having a target range, the load impedance being an impedance of the external load.
-
公开(公告)号:US11456557B2
公开(公告)日:2022-09-27
申请号:US17277340
申请日:2019-10-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yongwon Cho , Gyunghoon Lee , Minyong Kim , Samyeol Kang
Abstract: According to an embodiment, disclosed is an electronic device that includes an external interface module including a printed circuit board and at least one part disposed on the printed circuit board, a protective structure including at least one hole area that isolates at least a portion of the at least one part, and a housing that provides at least a bottom portion on which the protective structure is seated. Besides, it may be permissible to prepare various other embodiments speculated through the specification.
-
公开(公告)号:US12272863B2
公开(公告)日:2025-04-08
申请号:US18109006
申请日:2023-02-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yonghee An , Pilwon Seo , Bitna Kim , Haewon Sung , Yongwon Cho , Junhee Han , Jeongseob Kim , Hyunsuk Choi
Abstract: An electronic device includes a housing, an antenna structure disposed in an inner space of the housing, a wireless communication circuit disposed in the inner space, and a first bracket. The antenna structure includes a substrate having a first substrate surface facing in a first direction and a second substrate surface facing in a second direction opposite to the first substrate surface, and a plurality of chip antennas sequentially arranged on the first substrate surface in a third direction perpendicular to the first direction. Each of the plurality of chip antennas includes an antenna element and is separated in the third direction from remaining chip antennas by separation spaces. The first bracket includes first and second protrusions that protrude in the second direction to correspond to the first substrate surface of the substrate. The protrusions are aligned, in the third direction, with the separation spaces.
-
公开(公告)号:US12160983B2
公开(公告)日:2024-12-03
申请号:US17835111
申请日:2022-06-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyunjoong Yoon , Yongwon Cho
Abstract: An electronic device and a support plate are disclosed. The electronic device includes a first housing, a display disposed within the first housing, a printed circuit board disposed within the first housing, a heat dissipation plate disposed to face the printed circuit board, at least one heat pipe disposed between the heat dissipation plate and the printed circuit board, the support plate disposed between the printed circuit board and the heat dissipation plate. The support plate includes a first portion disposed so as to contact with at least a part of the at least one heat pipe, and a second portion extending from the first portion in a second direction perpendicular to a first direction in which the at least one heat pipe is disposed, the second portion coupled to at least a part of the heat dissipation plate.
-
公开(公告)号:US11978276B2
公开(公告)日:2024-05-07
申请号:US17985596
申请日:2022-11-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junhee Han , Hanul Moon , Soohwan Kim , Seungjae Bae , Inho Shin , Jiyoung Lim , Yongwon Cho , Jiwoo Lee
CPC classification number: G06V40/13 , G06F1/1633
Abstract: According to various embodiments, an electronic device is provided and includes a housing, a support frame which is arranged in an internal space of the housing and has a first surface, a second surface facing a direction opposite to the first surface, and a through hole, a display supported by the first surface and arranged to be seen from outside through at least a part of the housing, and an optical sensor module arranged in the second surface to face the through hole.
-
-
-
-
-
-
-
-
-