公开(公告)号：US11800688B2

公开(公告)日：2023-10-24

申请号：US17289285

申请日：2019-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haein Chung ,  Kyungha Koo ,  Seungjae Bae ,  Hyunjoong Yoon ,  Jaeho Chung ,  Yongwon Cho

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20509 ,  G06F1/203 ,  H05K7/20336

Abstract: An embodiment of the present invention discloses a heat dissipation structure and an electronic device including the heat dissipation structure, the heat dissipation structure comprising: at least one heat dissipation plate; at least one rigid plate which forms an opening in one area and is coupled to the upper portion of the at least one heat dissipation plate to support durability of the at least one heat dissipation plate; at least one heat pipe of which at least a portion is accommodated in the opening formed by the at least one rigid plate and is coupled to an area of the at least one heat dissipation plate that faces the at least one heat pipe; and at least one fixing tool which supports the fixing between the at least one heat dissipation plate and the at least one rigid plate. In addition, various embodiments identified through the specification are possible.