公开(公告)号：US12160983B2

公开(公告)日：2024-12-03

申请号：US17835111

申请日：2022-06-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjoong Yoon ,  Yongwon Cho

IPC: H05K7/20 ,  H05K1/02

Abstract: An electronic device and a support plate are disclosed. The electronic device includes a first housing, a display disposed within the first housing, a printed circuit board disposed within the first housing, a heat dissipation plate disposed to face the printed circuit board, at least one heat pipe disposed between the heat dissipation plate and the printed circuit board, the support plate disposed between the printed circuit board and the heat dissipation plate. The support plate includes a first portion disposed so as to contact with at least a part of the at least one heat pipe, and a second portion extending from the first portion in a second direction perpendicular to a first direction in which the at least one heat pipe is disposed, the second portion coupled to at least a part of the heat dissipation plate.

公开(公告)号：US11800688B2

公开(公告)日：2023-10-24

申请号：US17289285

申请日：2019-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haein Chung ,  Kyungha Koo ,  Seungjae Bae ,  Hyunjoong Yoon ,  Jaeho Chung ,  Yongwon Cho

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20509 ,  G06F1/203 ,  H05K7/20336

Abstract: An embodiment of the present invention discloses a heat dissipation structure and an electronic device including the heat dissipation structure, the heat dissipation structure comprising: at least one heat dissipation plate; at least one rigid plate which forms an opening in one area and is coupled to the upper portion of the at least one heat dissipation plate to support durability of the at least one heat dissipation plate; at least one heat pipe of which at least a portion is accommodated in the opening formed by the at least one rigid plate and is coupled to an area of the at least one heat dissipation plate that faces the at least one heat pipe; and at least one fixing tool which supports the fixing between the at least one heat dissipation plate and the at least one rigid plate. In addition, various embodiments identified through the specification are possible.

公开(公告)号：US11357142B2

公开(公告)日：2022-06-07

申请号：US16899118

申请日：2020-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjoong Yoon ,  Myunghoon Kwak ,  Minki Park ,  Youngjae You ,  Yongsang Yun

IPC: H05K9/00 ,  H05K7/20 ,  H01L23/40 ,  H05K1/02 ,  H01L23/552

Abstract: An electronic device having a shielding structure disposed around electronic components and having high heat dissipation performance is provided. The electronic device includes a circuit board, at least one electronic component mounted on a surface of the circuit board, a shielding sheet attached to the surface of the circuit board to cover the at least one electronic component, a thermal interface material stacked on the shielding sheet to overlap the at least one electronic component, and a heat dissipation member disposed to face the surface of the circuit board, being in surface contact with the thermal interface material, and fastened to at least a portion of the circuit board by a fixing member. Various other embodiments may be possible.

公开(公告)号：US12298817B2

公开(公告)日：2025-05-13

申请号：US17974044

申请日：2022-10-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoong Yoon ,  Gyunghoon Lee ,  Yongwon Cho

IPC: G06F1/16 ,  H01Q1/22

Abstract: An electronic device includes a first housing, a second housing, a hinge device that foldably couples the first housing and the second housing to each other, and at least one electrical connection member that connects a component included in the first housing and a component included in the second housing, to each other. The hinge device may include at least one hinge, at least one first hinge bracket that connects the hinge and the first housing to each other, at least one second hinge bracket that connects the hinge and the second housing to each other, and a support that supports the at least one electrical connection member, where the support may be fixed via the same fastening structure as the first hinge bracket.

公开(公告)号：US12225699B2

公开(公告)日：2025-02-11

申请号：US18160475

申请日：2023-01-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjoong Yoon ,  Heesoon Park

IPC: G06F1/16 ,  H01Q1/24 ,  H04M1/02 ,  H05K7/20 ,  H05K9/00

Abstract: An electronic device includes an electronic component on ae printed circuit board, an electrical shield extended around the electronic component and defining an opening corresponding to the electronic component, a heat diffusion pattern on the electronic component, and a shielding sheet which extends across the opening of the electrical shield and commonly overlaps the electronic component, the electrical shield and the heat diffusion pattern. The shielding sheet includes a first heat diffusion member which is inside the opening of the electrical shield and contacts the heat diffusion pattern, and a second heat diffusion member which is attached to the first heat diffusion member, extends across the opening of the electrical shield and contacts both an upper portion of the electrical shield and the first heat diffusion member.