SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    2.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20130240959A1

    公开(公告)日:2013-09-19

    申请号:US13716402

    申请日:2012-12-17

    CPC classification number: H01L29/78 H01L27/10876 H01L27/10885 H01L27/10888

    Abstract: A semiconductor device may include a substrate including an active pattern delimited by a device isolation pattern, a gate electrode crossing the active pattern, a first impurity region and a second impurity region in the active pattern on both sides of the gate electrode, a bit line crossing the gate electrode, a first contact electrically connecting the first impurity region with the bit line, and a first nitride pattern on a lower side surface of the first contact. A width of the first contact measured perpendicular to an extending direction of the bit line may be substantially equal to that of the bit line.

    Abstract translation: 半导体器件可以包括:衬底,其包括由器件隔离图案限定的有源图案,与有源图案交叉的栅极电极,栅电极两侧的有源图案中的第一杂质区域和第二杂质区域,位线 跨越栅电极,将第一杂质区与位线电连接的第一接触和第一接触的下侧表面上的第一氮化物图案。 垂直于位线的延伸方向测量的第一接触件的宽度可以基本上等于位线的宽度。

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