公开(公告)号：US20220102224A1

公开(公告)日：2022-03-31

申请号：US17460207

申请日：2021-08-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangmin AN ,  Haengjin LEE ,  Changseok HAN ,  Taehwan OH ,  Minchul JUN ,  Byeongcheol CHOI

IPC: H01L21/66 ,  G11C14/00 ,  H01L23/31 ,  G01R31/28 ,  G01R31/3185 ,  H01L25/065

Abstract: A method of manufacturing a multi-chip package (MCP) is provided. The MCP includes a first type semiconductor chip, a second type semiconductor chip, and a memory controller configured to control the second type semiconductor chip. The method includes mounting the first type semiconductor chip and the memory controller on a substrate, mounting the second type semiconductor chip on the first type semiconductor chip, forming a mold layer to cover the first and second type semiconductor chips and the memory controller, performing a function test on the first type semiconductor chip and simultaneously determining whether a crack defect occurred in the second type semiconductor chip. The crack defect of the second type semiconductor chip is determined when a current measured in a low power mode test of the second type semiconductor chip is greater than or equal to a test reference value.

公开(公告)号：US20200346143A1

公开(公告)日：2020-11-05

申请号：US16567052

申请日：2019-09-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehoi PARK ,  Sangjin KIM ,  Nakhee SEONG ,  Woojeong SHIN ,  Taehwan OH ,  Kwangsub YOON

IPC: B01D35/26 ,  G03F7/16 ,  B01D36/00

Abstract: A resist coating apparatus including a resist supplying system; a resist filtering system having a first filter, a second filter, and a pump between the first filter and the second filter; and a resist dispensing system, wherein the first filter includes a plurality of first unit filters connected in parallel.