公开(公告)号：US20220102224A1

公开(公告)日：2022-03-31

申请号：US17460207

申请日：2021-08-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangmin AN ,  Haengjin LEE ,  Changseok HAN ,  Taehwan OH ,  Minchul JUN ,  Byeongcheol CHOI

IPC: H01L21/66 ,  G11C14/00 ,  H01L23/31 ,  G01R31/28 ,  G01R31/3185 ,  H01L25/065

Abstract: A method of manufacturing a multi-chip package (MCP) is provided. The MCP includes a first type semiconductor chip, a second type semiconductor chip, and a memory controller configured to control the second type semiconductor chip. The method includes mounting the first type semiconductor chip and the memory controller on a substrate, mounting the second type semiconductor chip on the first type semiconductor chip, forming a mold layer to cover the first and second type semiconductor chips and the memory controller, performing a function test on the first type semiconductor chip and simultaneously determining whether a crack defect occurred in the second type semiconductor chip. The crack defect of the second type semiconductor chip is determined when a current measured in a low power mode test of the second type semiconductor chip is greater than or equal to a test reference value.

公开(公告)号：US20230402341A1

公开(公告)日：2023-12-14

申请号：US18133178

申请日：2023-04-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangmin AN ,  Sukyoung LEE

IPC: H01L23/34 ,  H01L21/66 ,  H01L23/31

CPC classification number: H01L23/34 ,  H01L22/12 ,  H01L23/3121

Abstract: A method of providing a surface temperature of a semiconductor package including a semiconductor die that is packaged using a molding material includes setting an air temperature near the semiconductor package to each of reference temperatures, measuring reference code values respectively corresponding to the reference temperatures based on a temperature code indicating a junction temperature in the semiconductor die while the air temperature is set to each of the reference temperatures, the temperature code being provided from a reference temperature measurement circuit integrated in the semiconductor package, generating calibration information that indicates mapping relationships between the reference temperatures and the reference code values, and providing a present surface temperature of the semiconductor package based on the calibration information and a present code value of the temperature code.