公开(公告)号：US20130299969A1

公开(公告)日：2013-11-14

申请号：US13835969

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Won KIM ,  Kwang-Chul CHOI ,  Hyun-Jung SONG ,  Cha-Jea JO ,  Eun-Kyoung CHOI ,  Ji-Seok HONG

IPC: H01L23/498 ,  H01L21/56

CPC classification number: H01L23/49811 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a sealing member. The first semiconductor chip includes a substrate having a first surface and a second surface opposite to the first surface and having an opening that extends in a predetermined depth from the second surface, and a plurality of through electrodes extending in a thickness direction from the first surface, end portions of the through electrodes being exposed through a bottom surface of the opening. The second semiconductor chip is received in the opening and mounted on the bottom surface of the opening. The sealing member covers the second semiconductor chip in the opening.

Abstract translation: 半导体封装包括第一半导体芯片，第二半导体芯片和密封构件。 第一半导体芯片包括具有与第一表面相对的第一表面和第二表面的基板，并且具有从第二表面以预定深度延伸的开口，以及从厚度方向从第一表面延伸的多个贯穿电极 通孔的端部通过开口的底表面露出。 第二半导体芯片被容纳在开口中并安装在开口的底表面上。 密封构件覆盖开口中的第二半导体芯片。

公开(公告)号：US20190075370A1

公开(公告)日：2019-03-07

申请号：US16119528

申请日：2018-08-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Won KIM ,  Young Kook KIM

IPC: H04N21/8358 ,  H04N21/4223 ,  H04N21/266 ,  H04N21/458

Abstract: A display apparatus, a content management apparatus, a content management system, and a content management method for verifying correct reproduction of content are provided. The display apparatus may include: a receiver configured to receive a content image; a display configured to reproduce the content image and display, over the content image being reproduced, a content identification color for identifying the content image; a sensing device mounted on at least one side of the display; and a controller configured to generate reproduction confirmation data for verifying reproduction of the content image based on an output of the sensing device.

公开(公告)号：US20150210017A1

公开(公告)日：2015-07-30

申请号：US14456405

申请日：2014-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyu-Hyun IM ,  No-kyoung PARK ,  Jae-hyun HUR ,  Sang-Won KIM ,  Sung-jee KIM

IPC: B29C67/20 ,  C01F7/02 ,  C01G9/02 ,  C01G23/047

CPC classification number: B29C67/20 ,  B29L2031/00 ,  C01F7/304 ,  C01G9/02 ,  C01G23/047 ,  C01P2004/03

Abstract: Provided is an example method of preparing a porous metal oxide structure, the method including adsorbing a metal oxide precursor onto a template having a networked structure of branched polynucleotides, decomposing and converting the adsorbed metal oxide precursor into a metal oxide, and removing the template. The networked structure of branched polynucleotides may be used as a template so as to facilitate control of the pore structure of a porous metal oxide structure.

Abstract translation: 提供了制备多孔金属氧化物结构的实例方法，该方法包括将金属氧化物前体吸附到具有支链多核苷酸网络结构的模板上，将吸附的金属氧化物前体分解并转化为金属氧化物，并除去模板。 支链多核苷酸的网络结构可以用作模板，以便于控制多孔金属氧化物结构的孔结构。

公开(公告)号：US20130181343A1

公开(公告)日：2013-07-18

申请号：US13653727

申请日：2012-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-Seok AHN ,  Sang-Won KIM ,  Young-Sang CHO ,  Kwang-Chul CHOI ,  Sung-Eun PYO

IPC: H01L21/78 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/3157 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A multi-chip package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first active surface. The second semiconductor chip has a second active surface facing the first active surface. The second active surface is electrically connected with the first active surfaceand the first active surface of the first semiconductor chip and the second active surface of the second semiconductor chip are bonded to each other without an adhesive.

Abstract translation: 多芯片封装包括第一半导体芯片和第二半导体芯片。 第一半导体芯片具有第一有源表面。 第二半导体芯片具有面向第一有源表面的第二有源表面。 第二有源表面与第一有源表面电连接，第一半导体芯片的第一有源表面和第二半导体芯片的第二有源表面彼此结合，而无需粘合剂。