公开(公告)号：US20170179569A1

公开(公告)日：2017-06-22

申请号：US15380326

申请日：2016-12-15

Applicant: Samsung Electronics Co., Ltd. ,  Korea University Research and Business Foundation

Inventor： Moonil KIM ,  Kyoung Min LEE ,  Seung Ho CHOI

IPC: H01Q1/22 ,  H01Q5/25 ,  H01Q1/38

Abstract: An apparatus of an antenna is provided. The apparatus includes a first conductor plate disposed on an upper side of a single plate and comprising an aperture, a plurality of vias inserted to vertically penetrate through the single plate, a second conductor plate disposed on a lower side of the single plate, and a feed line for applying a signal to radiate to a dielectric resonator embedded as a cavity which is formed by the first conductor plate, the second conductor plate, and the vias. The aperture is in a size which produces multiple-resonance at an operating frequency.

公开(公告)号：US20200312797A1

公开(公告)日：2020-10-01

申请号：US16703279

申请日：2019-12-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myungsam KANG ,  Changbae LEE ,  Bongju CHO ,  Younggwan KO ,  Yongkoon LEE ,  Moonil KIM ,  Youngchan KO

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/522 ,  H01L23/00

Abstract: A semiconductor package includes: a connection structure including one or more redistribution layers; a core structure disposed on a surface of the connection structure; a semiconductor chip disposed on the surface and including connection pads electrically connected to the redistribution layers of the connection structure; a first encapsulant disposed on the surface and covering at least a portion of each of the core structure and the semiconductor chip; an antenna substrate disposed on the first encapsulant and including one or more wiring layers, at least a portion of the wiring layers including an antenna pattern; and a through via penetrating at least a portion of each of the connection structure, the core structure, the first encapsulant, and the antenna substrate.