Abstract:
A receiver circuit includes a first p-channel metal oxide semiconductor (PMOS) transistor, an input circuit, and an amplifier. The first PMOS transistor is configured to apply a power supply voltage to a power node in response to a clock signal. The input circuit is coupled to the power node, and configured to receive the power supply voltage, and the input circuit includes a plurality of PMOS transistors configured to generate a first sensing signal in response to an input signal and configured to generate a second sensing signal in response to at least one reference signal. The amplifier is configured to amplify the first sensing signal and the second sensing signal to generate a first output signal and a second output signal.
Abstract:
An apparatus for generating a 3D ultrasonic color image of a fetus based on skin color of a mother includes a sample image acquisition unit acquiring a sample image by photographing a skin of a pregnant woman, a 2D color map generator generating a 2D color map based on the sample image, a probe irradiating ultrasonic signals into the pregnant woman and receiving reflected ultrasonic echo signals, a volume data generator generating 3D volume data based on the ultrasonic echo signals, and a controller generating a 3D ultrasonic color image of the fetus by applying values of the 2D color map to a 3D ultrasonic image obtained by volume rendering of the 3D volume data.
Abstract:
A semiconductor device includes a substrate having a cell region and a circuit region, an upper wiring layer on the substrate, and a redistribution wiring layer on the upper wiring layer. The upper wiring layer includes a secondary uppermost wiring in the circuit region and an uppermost wiring on the secondary uppermost wiring. The uppermost wiring includes an uppermost chip pad electrically connected to the secondary uppermost wiring. At least a portion of the uppermost chip pad in the cell region. The redistribution wiring layer includes a redistribution wiring electrically connected to the uppermost chip pad. At least a portion of the redistribution wiring serving as a landing pad connected to an external connector.
Abstract:
A buffer circuit includes a first differential amplifier, second differential amplifier, third differential amplifier, and mixer. The first differential amplifier generates a positive differential signal and a negative differential signal based on an input signal and a reference voltage signal. The second differential amplifier generates a first signal based on the positive differential signal and the negative differential signal. The third differential amplifier generates a second signal having a different phase from the first signal based on the positive differential signal and the negative differential signal. The mixer outputs a signal, generated by mixing the first signal and the second signal, as an output signal.