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公开(公告)号：US11588220B2
公开(公告)日：2023-02-21
申请号：US17162110
申请日：2021-01-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yunbum Lee , Seongbeom Hong , Kyunghoon Moon , Seunggil Jeon , Jaeyoung Huh , Jinsang Kim , Sungchul Park
IPC: H01Q1/02 , H01Q9/04 , H01Q21/08 , H01Q19/09 , H01Q21/28 , H01Q23/00 , H01Q1/24 , H01Q1/22 , H01Q1/40
Abstract: An electronic device is provided. The electronic device includes a display having a first surface, a metal frame structure configured to form a side surface of the electronic device, a rear plate having a second surface facing a third direction, at least one antenna module disposed inside the side surface and having a radiation surface, at least one dielectric layer having at least a partial region attached to the radiation surface, and a wireless communication circuit configured to transmit or receive an radio frequency (RF) signal to or from the at least one antenna module, in which the at least one dielectric layer includes a first dielectric sheet and a second dielectric sheet, in which the first dielectric sheet is made of a thermal conductive material having a first permittivity and the second dielectric sheet is made of a material having a second permittivity larger than the first permittivity.
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公开(公告)号：US12176609B2
公开(公告)日：2024-12-24
申请号：US17987343
申请日：2022-11-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Byungjoon Kim , Kyunghoon Moon , Heejin Park , Yongyoun Kim , Youngmi Jang , Eunseong Choi
Abstract: An electronic device is provided. The electronic device includes: a first housing comprising a first support member facing in a first direction, a first rear cover facing in a second direction opposite the first direction, and a first side member surrounding a first space between the first support member and the first rear cover; a second housing; a hinge structure connected to the first housing and the second housing and configured to be folded about a folding axis; a first antenna structure disposed in the first space and configured to form a first electric field in the second direction; a second antenna structure disposed near the first antenna structure in the first space; and a conductive member disposed between the first antenna structure and the second antenna structure.
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公开(公告)号：US12218420B2
公开(公告)日：2025-02-04
申请号：US17987343
申请日：2022-11-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Byungjoon Kim , Kyunghoon Moon , Heejin Park , Yongyoun Kim , Youngmi Jang , Eunseong Choi
Abstract: An electronic device is provided. The electronic device includes: a first housing comprising a first support member facing in a first direction, a first rear cover facing in a second direction opposite the first direction, and a first side member surrounding a first space between the first support member and the first rear cover; a second housing; a hinge structure connected to the first housing and the second housing and configured to be folded about a folding axis; a first antenna structure disposed in the first space and configured to form a first electric field in the second direction; a second antenna structure disposed near the first antenna structure in the first space; and a conductive member disposed between the first antenna structure and the second antenna structure.
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公开(公告)号：US10511271B2
公开(公告)日：2019-12-17
申请号：US15862213
申请日：2018-01-04
Inventor： Jihoon Kim , Bumman Kim , Kyunghoon Moon , Seokwon Lee , Daechul Jeong , Byungjoon Park , Juho Son
Abstract: The method and system for converging a 5th-generation (5G) communication system for supporting higher data rates beyond a 4th-generation (4G) system with a technology for internet of things (IoT) are provided. The method includes intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. The system includes a power amplification device capable of minimizing the effect of envelope impedance. The power amplification device may be incorporated in a terminal and a base station.
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Patent Agency Ranking
公开(公告)号：US11777193B2
公开(公告)日：2023-10-03
申请号：US16866011
申请日：2020-05-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seunggil Jeon , Namwoo Kim , Seongbeom Hong , Kyunghoon Moon , Yunbum Lee
CPC classification number: H01Q1/243 , H01Q21/065 , H04M1/0266 , H04M1/0277
Abstract: An electronic device is provided. The electronic device includes a front cover, a rear cover, an array antenna, and a support member. The support member includes a conductive first portion forming a lateral appearance of the electronic device, a second portion adjacent to the array antenna, the front cover, and the conductive first portion, and having at least one opening filled with a non-conductive material, and a third portion including a non-conductive material and disposed adjacent to the array antenna, the rear cover, and the conductive first portion. The conductive first portion is exposed to an outside of the electronic device, and the second and third portions are hidden by the front and rear covers. A beam formed by the array antenna is radiated to the outside through the at least one opening and the third portion.
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公开(公告)号：US10826162B1
公开(公告)日：2020-11-03
申请号：US16884713
申请日：2020-05-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seunggil Jeon , Namwoo Kim , Seongbeom Hong , Kyunghoon Moon , Yunbum Lee
Abstract: An electronic device is provided. The electronic device includes a front cover, a rear cover, an array antenna, and a support member. The support member includes a conductive first portion forming a lateral appearance of the electronic device, a second portion adjacent to the array antenna, the front cover, and the conductive first portion, and having at least one opening filled with a non-conductive material, and a third portion including a non-conductive material and disposed adjacent to the array antenna, the rear cover, and the conductive first portion. The conductive first portion is exposed to an outside of the electronic device, and the second and third portions are hidden by the front and rear covers. A beam formed by the array antenna is radiated to the outside through the at least one opening and the third portion.
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公开(公告)号：US20230136210A1
公开(公告)日：2023-05-04
申请号：US17987343
申请日：2022-11-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Byungjoon KIM , Kyunghoon Moon , Heejin Park , Yongyoun Kim , Youngmi Jang , Eunseong Choi
Abstract: An electronic device is provided. The electronic device includes: a first housing comprising a first support member facing in a first direction, a first rear cover facing in a second direction opposite the first direction, and a first side member surrounding a first space between the first support member and the first rear cover; a second housing; a hinge structure connected to the first housing and the second housing and configured to be folded about a folding axis; a first antenna structure disposed in the first space and configured to form a first electric field in the second direction; a second antenna structure disposed near the first antenna structure in the first space; and a conductive member disposed between the first antenna structure and the second antenna structure.
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公开(公告)号：US11283156B2
公开(公告)日：2022-03-22
申请号：US16788925
申请日：2020-02-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seunggil Jeon , Namwoo Kim , Seongbeom Hong , Kyunghoon Moon , Yunbum Lee
IPC: H01Q1/24
Abstract: Disclosed is an electronic device including a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a lateral member surrounding a space between the first plate and the second plate, a first antenna structure disposed to be substantially parallel with the second plate in the space, and including a substrate disposed in the space, and at least one antenna element disposed on the substrate to face at least the second plate, a conductive member disposed in the space and spaced apart from the at least one antenna element by a predetermined interval when the second plate is viewed from above.
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公开(公告)号：US11038476B2
公开(公告)日：2021-06-15
申请号：US16715502
申请日：2019-12-16
Inventor： Jihoon Kim , Bumman Kim , Kyunghoon Moon , Seokwon Lee , Daechul Jeong , Byungjoon Park , Juho Son
Abstract: The method and system for converging a 5th-generation (5G) communication system for supporting higher data rates beyond a 4th-generation (4G) system with a technology for internet of things (IoT) are provided. The method includes intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. The system includes a power amplification device capable of minimizing the effect of envelope impedance. The power amplification device may be incorporated in a terminal and a base station.
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