公开(公告)号：US11715628B2

公开(公告)日：2023-08-01

申请号：US17184962

申请日：2021-02-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeongil Mun ,  Kyeonghun Kim ,  Taekyoon Park ,  Jongwoo Sun ,  Seeyub Yang ,  Yongseok Lee ,  Hyungjoo Lee ,  Eunhee Jeang

IPC: H01J37/32 ,  H01J9/24

CPC classification number: H01J37/32467 ,  H01J9/245 ,  H01J37/32119 ,  H01J37/32238 ,  H01J37/32972 ,  H01J2237/103

Abstract: A method of forming a plasma processing apparatus comprises providing a chamber, the chamber including a wall defining an interior, and a viewport extending through the wall. An analysis apparatus connected to the viewport may be formed. The analysis apparatus includes an analyzer adjacent to the chamber, a probe connected to the analyzer and aligned with the viewport, and a first window aligned with the probe, the first window having a first surface, and a second surface at an opposite side relative to the first surface, the second surface being exposed to the interior of the chamber, and the second surface of the first window has a scattering surface.

公开(公告)号：US10935429B2

公开(公告)日：2021-03-02

申请号：US16536944

申请日：2019-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyeonghun Kim ,  Jeongil Mun ,  Hyung Joo Lee ,  Jongwoo Sun

IPC: G01J3/30 ,  G01J3/443 ,  H01J37/32 ,  G01J3/28

Abstract: A substrate processing module includes a process chamber configured to perform a treatment process on a substrate; a transfer chamber provided on a first side of the process chamber, the substrate being transferred between the process chamber and the transfer chamber; an optical emission spectroscopy (OES) system provided on a second side of the process chamber and configured to monitor the process chamber; and a reference light source disposed in the transfer chamber and configured to emit a reference light to calibrate the OES system.

公开(公告)号：US11264291B2

公开(公告)日：2022-03-01

申请号：US16822319

申请日：2020-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seeyub Yang ,  Jeongil Mun ,  Hyungjoo Lee ,  Kyoungsuk Kim ,  Kyeonghun Kim ,  Jongwoo Sun

IPC: H01J37/32 ,  H01L21/66 ,  H01L21/67 ,  H01L21/311

Abstract: An etching apparatus includes a reaction chamber having an internal space, a fixing chuck disposed in the reaction chamber, an electrostatic chuck disposed on the fixing chuck and on which a wafer is placed, a focus ring surrounding the electrostatic chuck, and a sensor device configured to be transferred into or out of the reaction chamber and placed on the electrostatic chuck. The sensor device includes a body having a plate shape, and a sensor disposed on an upper surface of the body which senses whether the focus ring is worn.

公开(公告)号：US11215506B2

公开(公告)日：2022-01-04

申请号：US17162665

申请日：2021-01-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyeonghun Kim ,  Jeongil Mun ,  Hyung Joo Lee ,  Jongwoo Sun

IPC: G01J3/443 ,  H01J37/32 ,  G01J3/28

Abstract: A substrate processing module includes a process chamber configured to perform a treatment process on a substrate; a transfer chamber provided on a first side of the process chamber, the substrate being transferred between the process chamber and the transfer chamber; an optical emission spectroscopy (OES) system provided on a second side of the process chamber and configured to monitor the process chamber; and a reference light source disposed in the transfer chamber and configured to emit a reference light to calibrate the OES system.