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    MULTI-CHIP PACKAGE WITH REDUCED CALIBRATION TIME AND ZQ CALIBRATION METHOD THEREOF
    1.
    发明申请
    MULTI-CHIP PACKAGE WITH REDUCED CALIBRATION TIME AND ZQ CALIBRATION METHOD THEREOF 有权

    公开(公告)号：US20210065803A1

    公开(公告)日：2021-03-04

    申请号：US16834025

    申请日：2020-03-30

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Junha LEE ,  Seonkyoo LEE ,  Jeongdon IHM ,  Byunghoon JEONG

    IPC: G11C16/06 ,  H01L25/065 ,  H01L23/66 ,  H01L25/18

    Abstract: A multi-chip package with reduced calibration time and an impedance control (ZQ) calibration method thereof are provided. A master chip of the multi-chip package performs a first ZQ calibration operation by using a ZQ resistor, and then, the other slave chips simultaneously perform second ZQ calibration operations with respect to data input/output (DQ) pads of the slave chips by using a termination resistance value of a DQ pad of the master chip on the basis of a one-to-one correspondence relationship with the DQ pad of the master chip. The multi-chip package completes ZQ calibration by performing two ZQ calibration operations, thereby decreasing a ZQ calibration time.

    MEMORY DEVICE, MEMORY SYSTEM INCLUDING MEMORY DEVICE, AND OPERATING METHOD OF MEMORY DEVICE
    2.
    发明申请
    MEMORY DEVICE, MEMORY SYSTEM INCLUDING MEMORY DEVICE, AND OPERATING METHOD OF MEMORY DEVICE 有权

    公开(公告)号：US20250156310A1

    公开(公告)日：2025-05-15

    申请号：US18946517

    申请日：2024-11-13

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Junha LEE ,  Kyoungtae KANG ,  Hyunsuk KANG ,  Dongho SHIN ,  Kang Yoon LEE

    IPC: G06F12/02 ,  G06F13/40

    Abstract: A memory device includes data pads that are connected to an external memory controller, a ZQ pad that is connected to an external resistor, data drivers and receivers that are connected to the data pads and output first data signals to the data pads or receive second data signals from the data pads, and a ZQ calibrator that is connected to the ZQ pad. The memory device performs ZQ calibration based on a voltage of the ZQ pad, generates ZQ codes as a result of the ZQ calibration, and provides the ZQ codes to the data drivers and receivers. The ZQ calibrator performs a first-type ZQ calibration in response to a command received from the external memory controller and performs a second-type ZQ calibration without the command being received from the external memory controller.

    APPARATUSES AND METHODS FOR ZQ CALIBRATION
    3.
    发明申请
    APPARATUSES AND METHODS FOR ZQ CALIBRATION 有权

    公开(公告)号：US20230138561A1

    公开(公告)日：2023-05-04

    申请号：US17938214

    申请日：2022-10-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Dongho SHIN ,  Jungjune PARK ,  Kyoungtae KANG ,  Chiweon YOON ,  Junha LEE ,  Byunghoon JEONG

    IPC: G11C7/10 ,  H03K19/00

    Abstract: An apparatus and method for ZQ calibration, including determining a strong driver circuit and a weak driver circuit, which are related to an input/output (I/O) circuit connected to a signal pin, at power-up of the I/O circuit; providing a ZQ calibration code related to a sweep code to one from among the strong driver circuit and the weak driver circuit according to ZQ calibration conditions; and providing a ZQ calibration code related to a fixed code to an unselected circuit, thereby adjusting a termination resistance of the signal pin.

    MULTI-CHIP PACKAGE WITH REDUCED CALIBRATION TIME AND ZQ CALIBRATION METHOD THEREOF
    4.
    发明申请
    MULTI-CHIP PACKAGE WITH REDUCED CALIBRATION TIME AND ZQ CALIBRATION METHOD THEREOF 有权

    公开(公告)号：US20210366546A1

    公开(公告)日：2021-11-25

    申请号：US17393784

    申请日：2021-08-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Junha LEE ,  Seonkyoo LEE ,  Jeongdon IHM ,  Byunghoon JEONG

    IPC: G11C16/06 ,  H01L23/66 ,  H01L25/065 ,  H01L25/18

    Abstract: A multi-chip package with reduced calibration time and an impedance control (ZQ) calibration method thereof are provided. A master chip of the multi-chip package performs a first ZQ calibration operation by using a ZQ resistor, and then, the other slave chips simultaneously perform second ZQ calibration operations with respect to data input/output (DQ) pads of the slave chips by using a termination resistance value of a DQ pad of the master chip on the basis of a one-to-one correspondence relationship with the DQ pad of the master chip. The multi-chip package completes ZQ calibration by performing two ZQ calibration operations, thereby decreasing a ZQ calibration time.

    METHOD OF OPERATING A SYSTEM INCLUDING A PARAMETER MONITORING CIRCUIT
    5.
    发明申请
    METHOD OF OPERATING A SYSTEM INCLUDING A PARAMETER MONITORING CIRCUIT 有权

    公开(公告)号：US20210226613A1

    公开(公告)日：2021-07-22

    申请号：US17222033

    申请日：2021-04-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Dongho SHIN ,  Kyungtae KANG ,  Junha LEE ,  Tongsung KIM ,  Jangwoo LEE ,  Jeongdon IHM ,  Byunghoon JEONG

    IPC: H03K3/017 ,  H03K19/21 ,  H03K5/24

    Abstract: A method of operating a system including a parameter monitoring circuit and a host, includes generating a first parameter applying a first code to a current parameter, wherein a first offset is applied to the first code; generating a first comparison result by comparing the first parameter with a reference parameter value; generating a second parameter applying a second code to the current parameter, wherein a second offset is applied to the second code; generating a second comparison result by comparing the second parameter with the reference parameter value; detecting an error in the current parameter, based on the first comparison result and the second comparison result; and providing a signal based on the error to the host.

    MULTI-CHIP PACKAGE WITH REDUCED CALIBRATION TIME AND ZQ CALIBRATION METHOD THEREOF
    7.
    发明申请
    MULTI-CHIP PACKAGE WITH REDUCED CALIBRATION TIME AND ZQ CALIBRATION METHOD THEREOF 有权

    公开(公告)号：US20210065753A1

    公开(公告)日：2021-03-04

    申请号：US17012845

    申请日：2020-09-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Junha LEE ,  Seonkyoo LEE ,  Jeongdon IHM ,  Byunghoon JEONG

    IPC: G11C7/10 ,  H01L25/065 ,  H01L25/18 ,  H01L23/00

    Abstract: A multi-chip package with reduced calibration time and an impedance control (ZQ) calibration method thereof are provided. A master chip of the multi-chip package performs a first ZQ calibration operation by using a ZQ resistor, and then, the other slave chips simultaneously perform second ZQ calibration operations with respect to data input/output (DQ) pads of the slave chips by using a termination resistance value of a DQ pad of the master chip on the basis of a one-to-one correspondence relationship with the DQ pad of the master chip. The multi-chip package completes ZQ calibration by performing two ZQ calibration operations, thereby decreasing a ZQ calibration time.

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