公开(公告)号：US10991597B2

公开(公告)日：2021-04-27

申请号：US16657708

申请日：2019-10-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung-Hak Lee ,  Jaeyong Park ,  Jun-su Lim ,  Sungil Cho

IPC: H01L21/463 ,  H01L21/683 ,  H01L21/56 ,  H01L21/48 ,  H01L21/52 ,  H01L23/48 ,  H01L25/065 ,  H01L23/538 ,  H01L25/00

Abstract: A method of fabricating a semiconductor device is provided in which an adhesive layer is disposed on a first surface of a first semiconductor substrate. A carrier substrate is provided on the first surface of the first semiconductor substrate, and the carrier substrate is separated from a surface of the adhesive layer while the adhesive layer is still attached to the first surface of the first semiconductor substrate.

公开(公告)号：US10886248B2

公开(公告)日：2021-01-05

申请号：US16244345

申请日：2019-01-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-su Lim ,  Satoshi Inada

IPC: H01L23/00 ,  H01L21/268 ,  B23K26/03 ,  B23K26/20 ,  H01L21/18

Abstract: A laser bonding apparatus, a method of bonding a plurality of semiconductor devices arranged on a main substrate of a workpiece, to the main substrate, and a method of manufacturing a semiconductor package, the laser bonding apparatus including a chamber having a transmissive window and in which a workpiece is accommodatable; a gas supply conduit connected to the chamber and configured to supply a gas at an elevated pressure relative to a pressure outside of the chamber; and a laser generator arranged outside the chamber and configured to irradiate the workpiece accommodated in the chamber, through the transmissive window.