LIGHT EMITTING DEVICE AND A LIGHT SOURCE MODULE INCLUDING THE SAME

    公开(公告)号:US20200011518A1

    公开(公告)日:2020-01-09

    申请号:US16504983

    申请日:2019-07-08

    Abstract: A light source module including: a printed circuit board; a light emitting device mounted on the printed circuit board and including a plurality of subarrays each of the plurality of subarrays including a plurality of light emitting cells; and a plurality of driving chips mounted on the printed circuit board, wherein each of the plurality of driving chips respectively drives a corresponding one of the plurality of subarrays, wherein the plurality of subarrays are electrically isolated from each other.

    Method and apparatus for removing organic materials
    7.
    发明授权
    Method and apparatus for removing organic materials 有权
    去除有机材料的方法和装置

    公开(公告)号:US09352364B2

    公开(公告)日:2016-05-31

    申请号:US13874595

    申请日:2013-05-01

    CPC classification number: B08B7/028 B08B7/00 H01L21/02046

    Abstract: A method for removing organic materials includes providing a target object having the organic materials adsorbed thereon, and an adsorbent, into a space including a non-liquid medium therein; and separating the organic materials from the target object by applying ultrasound waves to the target object having the organic materials adsorbed thereon and the adsorbent in the space, and disposing the organic materials to the adsorbent.

    Abstract translation: 一种除去有机材料的方法包括将吸附有有机材料的目标物体和吸附剂提供到其中包含非液体介质的空间中; 并通过对吸附有有机材料的目标物体和空间中的吸附剂施加超声波,将有机材料与目标物体分离,并将有机材料设置在吸附剂上。

    LIGHT EMITTING DEVICE AND A LIGHT SOURCE MODULE INCLUDING THE SAME

    公开(公告)号:US20220243906A1

    公开(公告)日:2022-08-04

    申请号:US17721632

    申请日:2022-04-15

    Abstract: A light source module including: a printed circuit board; a light emitting device mounted on the printed circuit board and including a plurality of subarrays each of the plurality of subarrays including a plurality of light emitting cells; and a plurality of driving chips mounted on the printed circuit board, wherein each of the plurality of driving chips respectively drives a corresponding one of the plurality of subarrays, wherein the plurality of subarrays are electrically isolated from each other.

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