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公开(公告)号：US20200011518A1
公开(公告)日：2020-01-09
申请号：US16504983
申请日：2019-07-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Geun-woo Ko , Seung-woo Lee , Jun-ho Lee , Pun-jae Choi
IPC: F21V23/00
Abstract: A light source module including: a printed circuit board; a light emitting device mounted on the printed circuit board and including a plurality of subarrays each of the plurality of subarrays including a plurality of light emitting cells; and a plurality of driving chips mounted on the printed circuit board, wherein each of the plurality of driving chips respectively drives a corresponding one of the plurality of subarrays, wherein the plurality of subarrays are electrically isolated from each other.
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公开(公告)号：US11306908B2
公开(公告)日：2022-04-19
申请号：US16504983
申请日：2019-07-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Geun-woo Ko , Seung-woo Lee , Jun-ho Lee , Pun-jae Choi
IPC: F21V23/00 , F21Y115/10 , F21V23/04 , F21K9/27 , F21K9/233
Abstract: A light source module including: a printed circuit board; a light emitting device mounted on the printed circuit board and including a plurality of subarrays each of the plurality of subarrays including a plurality of light emitting cells; and a plurality of driving chips mounted on the printed circuit board, wherein each of the plurality of driving chips respectively drives a corresponding one of the plurality of subarrays, wherein the plurality of subarrays are electrically isolated from each other.
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Patent Agency Ranking
公开(公告)号：US11060689B2
公开(公告)日：2021-07-13
申请号：US16454852
申请日：2019-06-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yong-min Kwon , Pun-jae Choi , Geun-woo Ko , Jong-hyun Lee
IPC: F21S41/141 , H01L33/50 , H01L25/075 , H01L33/02 , B60Q1/04 , F21S41/657
Abstract: A light-emitting device includes an emission array including a plurality of light-emitting elements and a partition wall. The emission array includes a first region and a second region adjacent to each other. The partition wall is configured to isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array. The first region is associated with a first emission factor and the second region is associated with a second emission factor, the second emission factor different from the first emission factor.
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公开(公告)号：US09905739B2
公开(公告)日：2018-02-27
申请号：US15341293
申请日：2016-11-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jin-wook Chung , Jung-jin Kim , Pun-jae Choi , Si-han Kim , Sung-don Gang , Ah-young Woo
CPC classification number: H01L33/56 , H01L33/22 , H01L33/382 , H01L33/44 , H01L33/46 , H01L33/502 , H01L33/54 , H01L33/60
Abstract: A semiconductor light emitting device may include a light emitting package. A light emitting package may include a light emitting stack including a sequential stack of a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. An encapsulation layer may at least partially surround the second conductivity type semiconductor layer, and a wavelength conversion layer may cover the first conductivity type semiconductor layer. One or more of the encapsulation layer and the wavelength conversion layer may have a greater coefficient of thermal expansion (CTE) than a GaN-based compound semiconductor. The semiconductor light emitting device may include a stress applying structure that may apply a tensile stress to the light emitting stack. The light emitting stack may have reduced thermal droop at an operation temperature and improved luminous efficiency.
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公开(公告)号：US11592155B2
公开(公告)日：2023-02-28
申请号：US17373038
申请日：2021-07-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yong-min Kwon , Pun-jae Choi , Geun-woo Ko , Jong-hyun Lee
IPC: H01L33/50 , H01L25/075 , H01L33/02 , F21S41/657 , F21S41/141 , B60Q1/04
Abstract: A light-emitting device includes an emission array including a plurality of light-emitting elements and a partition wall. The emission array includes a first region and a second region adjacent to each other. The partition wall is configured to isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array. The first region is associated with a first emission factor and the second region is associated with a second emission factor, the second emission factor different from the first emission factor.
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公开(公告)号：US11573006B2
公开(公告)日：2023-02-07
申请号：US17721632
申请日：2022-04-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Geun-woo Ko , Seung-woo Lee , Jun-ho Lee , Pun-jae Choi
IPC: F21V23/00 , F21Y115/10 , F21V23/04 , F21K9/27 , F21K9/233
Abstract: A light source module including: a printed circuit board; a light emitting device mounted on the printed circuit board and including a plurality of subarrays each of the plurality of subarrays including a plurality of light emitting cells; and a plurality of driving chips mounted on the printed circuit board, wherein each of the plurality of driving chips respectively drives a corresponding one of the plurality of subarrays, wherein the plurality of subarrays are electrically isolated from each other.
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公开(公告)号：US20220243906A1
公开(公告)日：2022-08-04
申请号：US17721632
申请日：2022-04-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Geun-woo KO , Seung-woo Lee , Jun-ho Lee , Pun-jae Choi
IPC: F21V23/00
Abstract: A light source module including: a printed circuit board; a light emitting device mounted on the printed circuit board and including a plurality of subarrays each of the plurality of subarrays including a plurality of light emitting cells; and a plurality of driving chips mounted on the printed circuit board, wherein each of the plurality of driving chips respectively drives a corresponding one of the plurality of subarrays, wherein the plurality of subarrays are electrically isolated from each other.
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