公开(公告)号：US20200011518A1

公开(公告)日：2020-01-09

申请号：US16504983

申请日：2019-07-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Geun-woo Ko ,  Seung-woo Lee ,  Jun-ho Lee ,  Pun-jae Choi

IPC: F21V23/00

Abstract: A light source module including: a printed circuit board; a light emitting device mounted on the printed circuit board and including a plurality of subarrays each of the plurality of subarrays including a plurality of light emitting cells; and a plurality of driving chips mounted on the printed circuit board, wherein each of the plurality of driving chips respectively drives a corresponding one of the plurality of subarrays, wherein the plurality of subarrays are electrically isolated from each other.

公开(公告)号：US11592155B2

公开(公告)日：2023-02-28

申请号：US17373038

申请日：2021-07-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-min Kwon ,  Pun-jae Choi ,  Geun-woo Ko ,  Jong-hyun Lee

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/02 ,  F21S41/657 ,  F21S41/141 ,  B60Q1/04

Abstract: A light-emitting device includes an emission array including a plurality of light-emitting elements and a partition wall. The emission array includes a first region and a second region adjacent to each other. The partition wall is configured to isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array. The first region is associated with a first emission factor and the second region is associated with a second emission factor, the second emission factor different from the first emission factor.

公开(公告)号：US11573006B2

公开(公告)日：2023-02-07

申请号：US17721632

申请日：2022-04-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Geun-woo Ko ,  Seung-woo Lee ,  Jun-ho Lee ,  Pun-jae Choi

IPC: F21V23/00 ,  F21Y115/10 ,  F21V23/04 ,  F21K9/27 ,  F21K9/233

Abstract: A light source module including: a printed circuit board; a light emitting device mounted on the printed circuit board and including a plurality of subarrays each of the plurality of subarrays including a plurality of light emitting cells; and a plurality of driving chips mounted on the printed circuit board, wherein each of the plurality of driving chips respectively drives a corresponding one of the plurality of subarrays, wherein the plurality of subarrays are electrically isolated from each other.

公开(公告)号：US11306908B2

公开(公告)日：2022-04-19

申请号：US16504983

申请日：2019-07-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Geun-woo Ko ,  Seung-woo Lee ,  Jun-ho Lee ,  Pun-jae Choi

IPC: F21V23/00 ,  F21Y115/10 ,  F21V23/04 ,  F21K9/27 ,  F21K9/233

Abstract: A light source module including: a printed circuit board; a light emitting device mounted on the printed circuit board and including a plurality of subarrays each of the plurality of subarrays including a plurality of light emitting cells; and a plurality of driving chips mounted on the printed circuit board, wherein each of the plurality of driving chips respectively drives a corresponding one of the plurality of subarrays, wherein the plurality of subarrays are electrically isolated from each other.

公开(公告)号：US11060689B2

公开(公告)日：2021-07-13

申请号：US16454852

申请日：2019-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-min Kwon ,  Pun-jae Choi ,  Geun-woo Ko ,  Jong-hyun Lee

IPC: F21S41/141 ,  H01L33/50 ,  H01L25/075 ,  H01L33/02 ,  B60Q1/04 ,  F21S41/657

Abstract: A light-emitting device includes an emission array including a plurality of light-emitting elements and a partition wall. The emission array includes a first region and a second region adjacent to each other. The partition wall is configured to isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array. The first region is associated with a first emission factor and the second region is associated with a second emission factor, the second emission factor different from the first emission factor.

公开(公告)号：US09691954B2

公开(公告)日：2017-06-27

申请号：US15162754

申请日：2016-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-kuk Lee ,  Si-han Kim ,  Hyung-kun Kim ,  Yong-min Kwon ,  Geun-woo Ko

IPC: H01L33/00 ,  H01L33/60 ,  H01L33/06 ,  H01L33/32 ,  H01L33/18 ,  H01L33/62 ,  H01L33/38 ,  H01L33/56

CPC classification number: H01L33/60 ,  H01L33/007 ,  H01L33/06 ,  H01L33/18 ,  H01L33/32 ,  H01L33/38 ,  H01L33/382 ,  H01L33/44 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A light-emitting diode (LED) package includes a light-emitting structure including a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer; an isolating insulation layer; a first connection electrode portion and a second connection electrode portion electrically connected to the first conductive-type semiconductor layer and the second conductive-type semiconductor layer, respectively; a first electrode pad and a second electrode pad electrically connected to the first connection electrode portion and the second connection electrode portion, respectively; a first molding resin layer provided between the first electrode pad and the second electrode pad; a first pillar electrode and a second pillar electrode electrically connected to the first electrode pad and the second electrode pad, respectively; and a second molding resin layer provided on the first molding resin layer, the first electrode pad, and the second electrode pad, and between the first pillar electrode and the second pillar electrode.