SEMICONDUCTOR DEVICES
    2.
    发明公开

    公开(公告)号:US20240121957A1

    公开(公告)日:2024-04-11

    申请号:US18240017

    申请日:2023-08-30

    Abstract: A semiconductor device includes a gate electrode structure, a memory channel structure, a first division pattern, and first support patterns. The gate electrode structure includes gate electrodes spaced apart from each other on a substrate in a first direction perpendicular to an upper surface of the substrate, and each of the gate electrodes extends in a second direction parallel to the upper surface of the substrate. The memory channel structure extends through the gate electrode structure on the substrate. The first division pattern is formed on a sidewall of the gate electrode structure in a third direction parallel to the upper surface of the substrate and crossing the second direction, and extends in the second direction. The first support patterns are spaced apart from each other in the second direction on the first division pattern, and each of the first support patterns includes a conductive material.

    Lens assembly and electronic device including the same

    公开(公告)号:US11726301B2

    公开(公告)日:2023-08-15

    申请号:US17065650

    申请日:2020-10-08

    CPC classification number: G02B13/0045 G02B5/005 G02B9/62

    Abstract: Disclosed herein is a lens assembly that includes an aperture stop and at least three lenses. The first lens is disposed closer to the image sensor than the aperture stop, the first lens including two convex surfaces. The second lens is disposed closer to the image sensor than the first lens, and includes convex and concave surfaces. And the third lens is disposed closer to the image sensor than the second lens. The lens assembly meets Equation 1:

    0.1≤CT15/StopL≤0.4



    wherein “CT15” denotes a distance between the object-side surface of the first lens and the object-side surface of the third lens measured along the optical axis, and “StopL” denotes a distance between an image forming surface of the image sensor and the aperture stop measured along the optical axis. Other various embodiments are also disclosed.

    Outdoor unit of airconditioner
    5.
    发明授权

    公开(公告)号:US11378288B2

    公开(公告)日:2022-07-05

    申请号:US16778613

    申请日:2020-01-31

    Abstract: An outdoor unit of an air conditioner having an expansion valve unit. The outdoor unit of the air conditioner includes a compressor, a heat exchanger configured to exchange heat between outdoor air and refrigerant compressed by the compressor, an expansion valve unit configured to decompress the refrigerant discharged from the heat exchanger, a refrigerant pipe configured to deliver the refrigerant, which is decompressed and expanded by the expansion valve unit, to the indoor unit of the air conditioner, and a bracket configured to support the expansion valve unit. The expansion valve unit includes an expansion valve, a first connection portion configured to connect the expansion valve to the heat exchanger, and a second connection portion configured to connect the expansion valve to the refrigerant pipe. The expansion valve, and one of the first connection portion or the second connection portion are fixed to the bracket.

    Electronic device comprising reinforcement structure for damage prevention

    公开(公告)号:US12069815B2

    公开(公告)日:2024-08-20

    申请号:US17824142

    申请日:2022-05-25

    CPC classification number: H05K5/0069 H01R12/75 H05K5/0017

    Abstract: An electronic device is provided. The electronic device includes a display forming the front surface of the electronic device, a housing in which the display is seated and which at least forms a first side surface of the electronic device, an opening provided in the first side surface formed by the housing, a printed circuit board disposed adjacent to the first side surface, a connecting interface disposed on the PCB so as to be electrically connected to an external connector when the external connector is inserted through the opening, and a reinforcement member disposed on the PCB so as to surround the side surface of the connecting interface without covering the top surface of the connecting interface.

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