公开(公告)号：US20160058406A1

公开(公告)日：2016-03-03

申请号：US14807027

申请日：2015-07-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeon Min LEE ,  Geun Tae BAE ,  Qin LIU ,  Jeong Min LEE ,  WooYoung JANG ,  Woo Sup HAN

IPC: A61B6/00

CPC classification number: A61B6/5211 ,  A61B6/4225 ,  A61B6/4233 ,  A61B6/4291 ,  A61B6/4441 ,  A61B6/481 ,  A61B6/487 ,  A61B6/504 ,  A61B6/5258 ,  A61B6/548 ,  A61B6/563 ,  A61B6/586 ,  A61B2576/00 ,  G06F11/202 ,  G06F19/00 ,  G06F19/321 ,  G06T1/20 ,  G16H40/40

Abstract: Disclosed herein are a radiographic imaging apparatus and a method of controlling the radiographic imaging apparatus. The radiographic imaging apparatus may include an imager configured to image a subject to obtain image data; a real-time processor configured to communicate with the imager and configured to obtain a real-time processing authority and perform real-time image processing on the image data; and a non-real-time processor configured to communicate with the imager and configured to perform non-real-time image processing on the image data, and in response to a failure occurring in the real-time processor, obtain the real-time processing authority and perform the real-time image processing on the image data.

Abstract translation: 本文公开了放射线照相成像装置和控制放射线照相成像装置的方法。 射线照相成像装置可以包括：成像器，被配置为对被摄体进行成像以获得图像数据; 实时处理器，被配置为与成像器通信并被配置为获得实时处理权限并对图像数据执行实时图像处理; 以及非实时处理器，被配置为与所述成像器进行通信并被配置为对所述图像数据执行非实时图像处理，并且响应于在所述实时处理器中发生的故障，获得所述实时处理 并对图像数据执行实时图像处理。

公开(公告)号：US20250149475A1

公开(公告)日：2025-05-08

申请号：US18802580

申请日：2024-08-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min Seung JI ,  Ha Seob SEONG ,  Hyeon Min LEE ,  Ae-Nee JANG

IPC: H01L23/00 ,  H01L23/13 ,  H01L23/48 ,  H01L23/528 ,  H01L25/18 ,  H05K1/18 ,  H10B80/00

Abstract: A semiconductor includes a first semiconductor chip, and a second semiconductor chip provided on the first semiconductor chip. The first semiconductor chip includes a first semiconductor substrate including a first front side and a first back side, and a first back-side bonding layer including a first back-side bonding insulating film, and a first back-side bonding pad, wherein the second semiconductor chip includes a second semiconductor substrate including a second front side that faces the first back side and a second back side, and a second front-side bonding layer including a second front-side bonding insulating film bonded to the first back-side bonding insulating film. A side of the first semiconductor chip includes a plurality of first recesses, which are arranged along a vertical direction, and a second recess, which partially exposes a bottom surface of the second front-side bonding layer between the second front-side bonding layer and the first recesses.

公开(公告)号：US20140379130A1

公开(公告)日：2014-12-25

申请号：US14293443

申请日：2014-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong Jae LEE ,  Woo Sup HAN ,  Sang Kyun KANG ,  Hyeon Min LEE

IPC: G05D1/02

CPC classification number: B62D1/02 ,  B62D7/1509 ,  B62D15/00

Abstract: A movable medical apparatus may include a sensing unit to sense force externally applied to the movable medical apparatus, a control unit to generate one or more control signals to move, rotate, or stop the movable medical apparatus in accordance with the sensed force, and an apparatus moving unit to move, rotate, or stop the movable medical apparatus in accordance with the one or more control signals. A method for controlling movement of the movable medical apparatus may be implemented by the movable medical apparatus by sensing a force externally applied to the movable medical apparatus, generating a control signal based on the sensed force, and controlling movement of the movable medical apparatus based on the generated control signal.

Abstract translation: 可移动医疗装置可以包括用于感测外部施加到可移动医疗装置的力的感测单元，控制单元，用于根据感测到的力产生移动，旋转或停止可移动医疗装置的一个或多个控制信号，以及 装置移动单元，以根据所述一个或多个控制信号移动，旋转或停止可移动医疗装置。 可移动医疗装置的移动控制方法可以通过移动医疗装置，通过感测外部施加到可移动医疗装置的力，基于检测到的力产生控制信号，并且基于 生成的控制信号。