公开(公告)号：US20160093545A1

公开(公告)日：2016-03-31

申请号：US14723976

申请日：2015-05-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheol-woo LEE ,  Kang Soo LEE ,  Hyeon HWANG

IPC: H01L23/06 ,  H01L21/56 ,  H01L21/52 ,  H01L23/482

CPC classification number: H01L23/4827 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/562 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes: a package substrate; a semiconductor chip mounted on the package substrate and electrically connected to the package substrate; a first protective layer covering the semiconductor chip and having flexibility controlled by at least one of a material type, a thickness, a material composition ratio and viscosity of the first protective layer; and a second protective layer arranged on the first protective layer and having flexibility controlled by at least one of a material type and a thickness of the second protective layer, wherein the first protective layer comprises a first binder resin, a first hardener, and a first hardening catalyst. According to the semiconductor package of the inventive concept, protective layers protecting the semiconductor chip have flexibility, and thus, the semiconductor package may be bent.

Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括：封装衬底; 半导体芯片，其安装在所述封装基板上并电连接到所述封装基板; 覆盖半导体芯片的第一保护层，并且具有由第一保护层的材料类型，厚度，材料组成比和粘度中的至少一种控制的柔性; 以及布置在所述第一保护层上并具有由所述第二保护层的材料类型和厚度中的至少一种控制的柔性的第二保护层，其中所述第一保护层包括第一粘合剂树脂，第一固化剂和第一保护层 硬化催化剂。 根据本发明构思的半导体封装，保护半导体芯片的保护层具有柔性，从而可以使半导体封装弯曲。

公开(公告)号：US20250096148A1

公开(公告)日：2025-03-20

申请号：US18762757

申请日：2024-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kanggyune LEE ,  Sangwon LEE ,  Hyeon HWANG

IPC: H01L23/544 ,  H01L23/00 ,  H01L23/31

Abstract: A method of marking a semiconductor package includes preparing a semiconductor package including a semiconductor chip and a package molding layer surrounding semiconductor chip, attaching a dry film to a top surface of the package molding layer, the dry film being attached to a carrier substrate, forming an ink spot by liquefying a portion of the dry film by radiating laser light to the carrier substrate, forming an ink marking pattern by solidifying the ink spot corresponding to the liquefied portion of the dry film, and removing a remaining portion of the dry film from the top surface of the package molding layer, the remaining portion of the dry film having not been liquefied, wherein the ink marking pattern includes information about storage capacity or information for identifying a producer of a product.