公开(公告)号：US12027225B2

公开(公告)日：2024-07-02

申请号：US18109338

申请日：2023-02-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gyuchae Lee ,  Kyudong Lee

IPC: G11C5/06 ,  G11C5/04 ,  G11C11/4074 ,  G11C16/10 ,  G11C16/30

CPC classification number: G11C5/04 ,  G11C11/4074 ,  G11C16/10 ,  G11C16/30

Abstract: A memory module is provided including a plurality of semiconductor memory devices mounted on a circuit board. A control device is mounted on the circuit board and configured to receive a command signal, an address signal, and a clock signal and to provide the command signal, the address signal, and the clock signal to the plurality of semiconductor memory devices. A first group of the semiconductor memory devices is disposed between the control device and a first edge portion of the circuit board, and a second group of the semiconductor memory devices is disposed between the control device and a second edge portion of the circuit board. The control device is configured to transmit the address signal to the first group of the semiconductor memory devices and the second group of the semiconductor memory devices through a first transmission line and a second transmission line, respectively. The first transmission line and the second transmission line are physically symmetric with respect to an axis intersecting the control device.

公开(公告)号：US11631437B2

公开(公告)日：2023-04-18

申请号：US17344235

申请日：2021-06-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gyuchae Lee ,  Kyudong Lee

IPC: G11C5/06 ,  G11C5/04 ,  G11C16/30 ,  G11C16/10 ,  G11C11/4074

Abstract: A memory module is provided including a plurality of semiconductor memory devices mounted on a circuit board. A control device is mounted on the circuit board and configured to receive a command signal, an address signal, and a clock signal and to provide the command signal, the address signal, and the clock signal to the plurality of semiconductor memory devices. A first group of the semiconductor memory devices is disposed between the control device and a first edge portion of the circuit board, and a second group of the semiconductor memory devices is disposed between the control device and a second edge portion of the circuit board. The control device is configured to transmit the address signal to the first group of the semiconductor memory devices and the second group of the semiconductor memory devices through a first transmission line and a second transmission line, respectively. The first transmission line and the second transmission line are physically symmetric with respect to an axis intersecting the control device.

公开(公告)号：US11043246B2

公开(公告)日：2021-06-22

申请号：US16733803

申请日：2020-01-03

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Gyuchae Lee ,  Kyudong Lee

IPC: G11C5/06 ,  G11C5/04 ,  G11C16/30 ,  G11C16/10 ,  G11C11/4074

Abstract: A memory module is provided including a plurality of semiconductor memory devices mounted on a circuit board. A control device is mounted on the circuit board and configured to receive a command signal, an address signal, and a clock signal and to provide the command signal, the address signal, and the clock signal to the plurality of semiconductor memory devices. A first group of the semiconductor memory devices is disposed between the control device and a first edge portion of the circuit board, and a second group of the semiconductor memory devices is disposed between the control device and a second edge portion of the circuit board. The control device is configured to transmit the address signal to the first group of the semiconductor memory devices and the second group of the semiconductor memory devices through a first transmission line and a second transmission line, respectively. The first transmission line and the second transmission line are physically symmetric with respect to an axis intersecting the control device.