公开(公告)号：US20240377113A1

公开(公告)日：2024-11-14

申请号：US18615635

申请日：2024-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gibong LEE ,  Hackwon Hwang ,  Kukil Lee ,  Daesung Kim ,  Jaewon Yoo ,  Jinyeob Jang ,  Teacksoo Jung

IPC: F25B41/20 ,  F25B7/00

Abstract: A dual chiller system includes a high-temperature tank configured to supply a first coolant of a first temperature to the outside, a low-temperature tank configured to supply a second coolant of a second temperature lower than the first temperature to the outside, a first automatic inlet valve and a second automatic inlet valve respectively connected to the high-temperature tank and the low-temperature, a first substrate processing device configured to receive the first coolant or the second coolant from the first automatic inlet valve and a second substrate processing device configured to receive the first coolant or the second coolant from the second automatic inlet valve, a cooling unit and a system controller.

公开(公告)号：US20240053399A1

公开(公告)日：2024-02-15

申请号：US18232056

申请日：2023-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gibong LEE ,  Sungok Yu

IPC: G01R31/28

CPC classification number: G01R31/2877 ,  G01R31/2831

Abstract: A wafer test system includes: a first heat source unit including a first refrigerant having a first temperature range; a second heat source unit including a second refrigerant having a second temperature range; a wafer chuck to support a wafer, which: a heating member to heat the wafer, and a channel to circulate the first refrigerant and the second refrigerant; a first supply line connected to the first heat source unit, the first supply line to circulate and supply the first refrigerant to the channel; a second supply line connected to the second heat source unit, the second supply line to circulate and supply the second refrigerant to the channel; and a controller to selectively control supply of the first refrigerant and the second refrigerant based on a target temperature for testing the wafer on the wafer chuck.