公开(公告)号：US20240377113A1

公开(公告)日：2024-11-14

申请号：US18615635

申请日：2024-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gibong LEE ,  Hackwon Hwang ,  Kukil Lee ,  Daesung Kim ,  Jaewon Yoo ,  Jinyeob Jang ,  Teacksoo Jung

IPC: F25B41/20 ,  F25B7/00

Abstract: A dual chiller system includes a high-temperature tank configured to supply a first coolant of a first temperature to the outside, a low-temperature tank configured to supply a second coolant of a second temperature lower than the first temperature to the outside, a first automatic inlet valve and a second automatic inlet valve respectively connected to the high-temperature tank and the low-temperature, a first substrate processing device configured to receive the first coolant or the second coolant from the first automatic inlet valve and a second substrate processing device configured to receive the first coolant or the second coolant from the second automatic inlet valve, a cooling unit and a system controller.