公开(公告)号：US20240053399A1

公开(公告)日：2024-02-15

申请号：US18232056

申请日：2023-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gibong LEE ,  Sungok Yu

IPC: G01R31/28

CPC classification number: G01R31/2877 ,  G01R31/2831

Abstract: A wafer test system includes: a first heat source unit including a first refrigerant having a first temperature range; a second heat source unit including a second refrigerant having a second temperature range; a wafer chuck to support a wafer, which: a heating member to heat the wafer, and a channel to circulate the first refrigerant and the second refrigerant; a first supply line connected to the first heat source unit, the first supply line to circulate and supply the first refrigerant to the channel; a second supply line connected to the second heat source unit, the second supply line to circulate and supply the second refrigerant to the channel; and a controller to selectively control supply of the first refrigerant and the second refrigerant based on a target temperature for testing the wafer on the wafer chuck.