CHIP TYPE LAMINATED CAPACITOR
    3.
    发明申请
    CHIP TYPE LAMINATED CAPACITOR 有权
    芯片型层压电容器

    公开(公告)号:US20130208400A1

    公开(公告)日:2013-08-15

    申请号:US13753335

    申请日:2013-01-29

    IPC分类号: H01G4/01

    摘要: There is provided a chip type laminated capacitor, including: a ceramic body including a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 □m or less; first and second outer electrodes formed on both ends of the ceramic body in a length direction; first and second band parts formed to extend inwardly of the ceramic body in the length direction on a length-width (L-W) plane from the first and second outer electrodes and having different lengths; and third and fourth band parts formed to extend inwardly of the ceramic body in the length direction on a length-thickness (L-T) plane from the first and second outer electrodes and having different lengths.

    摘要翻译: 提供了一种片式叠层电容器,其包括:陶瓷体,其包括厚度等于其中包含的晶粒的平均粒径的10倍以上且为3μm以下的电介质层; 第一外电极和第二外电极,其在长度方向上形成在陶瓷体的两端; 第一和第二带部分形成为在第一和第二外部电极的长度(L-W)平面上沿长度方向在陶瓷体的内部延伸并具有不同的长度; 以及第三和第四带部分,其形成为在长度方向上在距第一和第二外部电极的长度 - 厚度(L-T)平面上延伸到陶瓷体的内侧并具有不同的长度。

    Chip type laminated capacitor
    10.
    发明授权
    Chip type laminated capacitor 有权
    片式叠层电容器

    公开(公告)号:US08908352B2

    公开(公告)日:2014-12-09

    申请号:US13693947

    申请日:2012-12-04

    摘要: There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 μm or less.

    摘要翻译: 提供一种芯片型层叠电容器,其包括:陶瓷体,其通过层叠厚度等于其中包含的晶粒的平均粒径的10倍以上且为3μm以下的电介质层而形成; 第一和第二外部电极; 第一内部电极,其一端与形成有第二外部电极的陶瓷体的一个端面一起形成第一边缘,而另一端通向第一外部电极; 以及第二内部电极,其一端与形成有第一外部电极的陶瓷体的另一个端面一起形成第二边缘,另一端通向第二外部电极,其中第一和第二边缘具有不同的宽度 在200μm以下的条件下。