公开(公告)号：US11776755B2

公开(公告)日：2023-10-03

申请号：US17060374

申请日：2020-10-01

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Hyung Duk Yun ,  Seonyoung Yoo ,  Hong Gi Kim ,  Byeongguk Choi ,  Young Hoon Song ,  Yuseop Lee ,  A Ra Cho ,  Donghwi Shin

IPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/008

CPC分类号： H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1218 ,  H01G4/2325

摘要： A multilayer ceramic electronic component includes a ceramic body having a dielectric layer, and a capacitance forming portion disposed in such a manner that first and second internal electrodes are stacked with the dielectric layer interposed therebetween, and first and second external electrodes disposed on the ceramic body, respectively, the first and second external electrodes including first and second base electrodes connected to the first and second internal electrodes, respectively, and first and second conductive layers disposed to cover the first and second base electrodes, respectively. The first and second conductive layers have a thickness in a range of 0.1 μm to 10 μm.