公开(公告)号：US20190252311A1

公开(公告)日：2019-08-15

申请号：US16053193

申请日：2018-08-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Akihisa KUROYANAGI ,  Jun Woo MYUNG ,  Eun Sil KIM ,  Yeong A KIM

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/528

CPC classification number: H01L23/5226 ,  H01L23/528 ,  H01L24/09 ,  H01L24/32 ,  H01L2224/02379 ,  H01L2224/0401

Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion and a stopper layer disposed on a bottom surface of the recess portion; a semiconductor chip disposed in the recess portion; a resin layer disposed on an active surface of the semiconductor chip; an encapsulant covering at least portions of side surfaces of the semiconductor chip and the resin layer and filling at least portions of the recess portion; a first redistribution layer disposed on the resin layer and the encapsulant; first redistribution vias penetrating through the resin layer to fill via holes in the resin layer exposing at least portions of the connection pads and electrically connecting the connection pads and the first redistribution layer to each other; and a connection member disposed on the resin layer and the encapsulant and including one or more second redistribution layers.

公开(公告)号：US20190139851A1

公开(公告)日：2019-05-09

申请号：US15950926

申请日：2018-04-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jun Woo MYUNG ,  Akihisa KUROYANAGI ,  Yeong A KIM ,  Eun Sil KIM

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/29

Abstract: A semiconductor package including an organic interposer includes: first and second semiconductor chips each having active surfaces having connection pads disposed thereon; the organic interposer disposed on the active surfaces of the first and second semiconductor chips and including a wiring layer electrically connected to the connection pads; barrier layers disposed onside surfaces of the first and second semiconductor chips; and an encapsulant encapsulating at least portions of the first and second semiconductor chips.

公开(公告)号：US20190131285A1

公开(公告)日：2019-05-02

申请号：US15900568

申请日：2018-02-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yeong A KIM ,  Eun Sil KIM ,  Young Gwan KO ,  Akihisa KUROYANAGI ,  Jin Su KIM ,  Jun Woo MYUNG

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L49/02 ,  H01L21/56 ,  H01L21/48 ,  H01L21/52

Abstract: A fan-out semiconductor package module includes a core member having first and second through-holes. A semiconductor chip is in the first through-hole and has an active surface with a connection pad and an inactive surface opposing the active surface. Another passive component is in the second through-hole. An first encapsulant covers at least portions of the core member and the passive component, and fills at least a portion of the second through-hole. A reinforcing member is on the first encapsulant. A second encapsulant covers at least a portion of the semiconductor chip, and fills at least a portion of the first through-hole. A connection member is on the core member, the active surface of the semiconductor chip, and the passive component, and includes a redistribution layer electrically connected to the connection pad and the passive component.