Thin film deposition apparatus
    1.
    发明授权

    公开(公告)号:US10287671B2

    公开(公告)日:2019-05-14

    申请号:US15145689

    申请日:2016-05-03

    Abstract: A thin film deposition apparatus that can be simply applied to produce large-sized display devices on a mass scale and that improves manufacturing yield. The thin film deposition apparatus includes a deposition source that discharges a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; and a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in a second direction that is perpendicular to the first direction. A deposition is performed while the substrate or the thin film deposition apparatus moves relative to each other in the first direction, and the deposition source, the deposition source nozzle unit, and the patterning slit sheet are formed integrally with each other.

    THIN FILM DEPOSITION APPARATUS
    3.
    发明申请
    THIN FILM DEPOSITION APPARATUS 审中-公开
    薄膜沉积装置

    公开(公告)号:US20160244872A1

    公开(公告)日:2016-08-25

    申请号:US15145689

    申请日:2016-05-03

    CPC classification number: C23C14/24 C23C14/042 H01L51/001

    Abstract: A thin film deposition apparatus that can be simply applied to produce large-sized display devices on a mass scale and that improves manufacturing yield. The thin film deposition apparatus includes a deposition source that discharges a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; and a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in a second direction that is perpendicular to the first direction. A deposition is performed while the substrate or the thin film deposition apparatus moves relative to each other in the first direction, and the deposition source, the deposition source nozzle unit, and the patterning slit sheet are formed integrally with each other.

    Abstract translation: 一种薄膜沉积装置,其可以简单地应用于大规模生产大尺寸显示装置并且提高制造产量。 薄膜沉积装置包括:放电沉积材料的沉积源; 沉积源喷嘴单元,设置在沉积源的一侧,并且包括沿第一方向布置的多个沉积源喷嘴; 以及与沉积源喷嘴单元相对设置并包括沿垂直于第一方向的第二方向布置的多个图案化狭缝的图案化缝隙片。 当基板或薄膜沉积装置在第一方向上相对移动时进行沉积,并且沉积源,沉积源喷嘴单元和图案化缝隙片彼此一体地形成。

    DEPOSITION SOURCE AND ORGANIC LAYER DEPOSITION APPARATUS INCLUDING THE SAME
    4.
    发明申请
    DEPOSITION SOURCE AND ORGANIC LAYER DEPOSITION APPARATUS INCLUDING THE SAME 有权
    沉积源和有机层沉积装置,包括它们

    公开(公告)号:US20160079534A1

    公开(公告)日:2016-03-17

    申请号:US14946686

    申请日:2015-11-19

    CPC classification number: H01L51/0004 C23C14/12 C23C14/243 H01L51/56

    Abstract: A deposition source and an organic layer deposition apparatus that may be simply applied to the manufacture of large-sized display apparatuses on a mass scale and may prevent or substantially prevent deposition source nozzles from being blocked during deposition of a deposition material, thereby improving manufacturing yield and deposition efficiency. A deposition source includes a first deposition source including a plurality of first deposition source nozzles, and a second deposition source including a plurality of second deposition source nozzles wherein the plurality of first deposition source nozzles and the plurality of second deposition source nozzles are tilted toward each other.

    Abstract translation: 沉积源和有机层沉积设备可以简单地应用于大规模的大型显示设备的制造,并且可以防止或基本上防止沉积源喷嘴在沉积材料沉积期间被阻挡,从而提高制造产量 和沉积效率。 沉积源包括包括多个第一沉积源喷嘴的第一沉积源和包括多个第二沉积源喷嘴的第二沉积源,其中多个第一沉积源喷嘴和多个第二沉积源喷嘴朝向每个 其他。

    THIN FILM DEPOSITION APPARATUS
    6.
    发明申请

    公开(公告)号:US20190226078A1

    公开(公告)日:2019-07-25

    申请号:US16368748

    申请日:2019-03-28

    Abstract: A thin film deposition apparatus that can be simply applied to produce large-sized display devices on a mass scale and that improves manufacturing yield. The thin film deposition apparatus includes a deposition source that discharges a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; and a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in a second direction that is perpendicular to the first direction. A deposition is performed while the substrate or the thin film deposition apparatus moves relative to each other in the first direction, and the deposition source, the deposition source nozzle unit, and the patterning slit sheet are formed integrally with each other.

    Thin film deposition apparatus
    8.
    发明授权

    公开(公告)号:US09624580B2

    公开(公告)日:2017-04-18

    申请号:US14203212

    申请日:2014-03-10

    Abstract: A method for forming a thin film on a substrate includes discharging a deposition material from a deposition source through a plurality of deposition source nozzles arranged in a first direction on a deposition source nozzle unit disposed at a side of the deposition source; passing the deposition material through a patterning slit sheet; and depositing the deposition material on the substrate, while moving the substrate and the patterning slit sheet relative to each other. The patterning slit sheet is spaced apart from the substrate by a distance. A blocking member is disposed between the substrate and the deposition source and is moved along with the substrate to be positioned to screen at least one portion of the substrate, and the patterning slit sheet is disposed opposite to and spaced apart from the deposition source nozzle unit, and includes a plurality of patterning slits arranged in the first direction.

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