公开(公告)号：US09879035B2

公开(公告)日：2018-01-30

申请号：US14707750

申请日：2015-05-08

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jinho Kwack ,  Seungyong Song ,  Taewook Kang ,  Youngseo Choi ,  Changmok Kim ,  Daebeom Shin ,  Yonghyuck Lee

IPC: H01L29/08 ,  C09K3/00 ,  H01L21/00 ,  C08F222/10 ,  C07F7/04 ,  C07C69/34 ,  C07C69/52 ,  C07F7/18 ,  C07C69/54 ,  C09D4/00 ,  C08F230/08 ,  C09D133/10 ,  H01L51/52

CPC classification number: C07F7/1804 ,  C07C69/54 ,  C08F222/1006 ,  C08F230/08 ,  C09D4/00 ,  C09D133/08 ,  C09D133/10 ,  H01L51/5256 ,  C08F2222/1013 ,  C08F220/30

Abstract: A composition for fabricating an organic film, an organic light-emitting display apparatus manufactured using the same, and a method of manufacturing the organic light-emitting display apparatus, the composition comprising a first compound that includes n substituents Y, and m polymerizable groups P1, wherein n is selected from 1, 2, 3, and 4; m is selected from 1, 2, 3, and 4; OP1 of the first compound is equal to or greater than 2.8 and equal to or less than 4.8; OP1 being (total number of atoms of the first compound)/{(number of carbon atoms of the first compound)−(number of oxygen atoms of the first compound)}; and RP1 of the first compound is equal to or greater than 0.01 and equal to or less than 0.46; RP1 being {(number of carbon atoms of the substituent Y)X n}/(number of carbon atoms of the first compound).

公开(公告)号：US10042253B2

公开(公告)日：2018-08-07

申请号：US15394096

申请日：2016-12-29

Applicant: Samsung Display Co., Ltd.

Inventor： Dongki Lee ,  Kyungah Kim ,  Gilrae Kim ,  Dongjin Kim ,  SungChul Kim ,  Hyoengki Kim ,  Junghwan Park ,  Daebeom Shin ,  Yuiku Lee

IPC: G03F7/032 ,  G03F7/004 ,  G03F7/033 ,  H01L27/32 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40

Abstract: A photosensitive resin composition includes a first binder resin represented by Formula 1. The photosensitive resin composition may be cured at a low temperature (e.g., about 0° C. to about 100° C., about 40° C. to about 100° C., or about 70° C. to about 100° C.). A film may be formed from the photosensitive resin composition. An organic light-emitting display (OLED) device may include the film prepared from the photosensitive resin composition.

公开(公告)号：US20170199454A1

公开(公告)日：2017-07-13

申请号：US15394096

申请日：2016-12-29

Applicant: Samsung Display Co., Ltd.

Inventor： Dongki Lee ,  Kyungah Kim ,  Gilrae Kim ,  Dongjin Kim ,  SungChul Kim ,  Hyoengki Kim ,  Junghwan Park ,  Daebeom Shin ,  Yuiku Lee

IPC: G03F7/032 ,  G03F7/033 ,  G03F7/40 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  H01L27/32 ,  G03F7/004

CPC classification number: G03F7/032 ,  G03F7/0045 ,  G03F7/033 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2002 ,  G03F7/327 ,  G03F7/40 ,  H01L27/322

Abstract: A photosensitive resin composition includes a first binder resin represented by Formula 1. The photosensitive resin composition may be cured at a low temperature (e.g., about 0° C. to about 100° C., about 40° C. to about 100° C., or about 70° C. to about 100° C.). A film may be formed from the photosensitive resin composition. An organic light-emitting display (OLED) device may include the film prepared from the photosensitive resin composition.