公开(公告)号：US20210222002A1

公开(公告)日：2021-07-22

申请号：US17081734

申请日：2020-10-27

申请人： SABIC Global Technologies B.V.

发明人： Xing Liu ,  Wei Shan ,  Jian Wang

IPC分类号： C08L69/00 ,  H01R13/527

摘要： A thermoplastic polycarbonate composition comprising: 10 to 30 wt % of a brominated polycarbonate; 10 to 80 wt % of a homopolycarbonate; optionally, 1 to 60 wt % of an aromatic poly(ester-carbonate) comprising carbonate units derived from bisphenol A, resorcinol, or a combination thereof, and ester units derived from a bisphenol, preferably bisphenol A, or resorcinol, and terephthalic acid, isoterephthalic acid, or a combination thereof, wherein a molar ratio of carbonate units to ester units ranges from 1:99 to 99:1; 5 to 15 wt % of a core-shell impact modifier; 1 to 10 wt % of an α,β-unsaturated glycidyl ester copolymer impact modifier; 0.01 to 1 wt % of a hydrostabilizer, preferably an epoxy hydrostabilizer; optionally, 0.1 to 10 wt % of an additive composition; wherein the wt % of each component is based on the total weight of the composition, which totals 100 wt %.

公开(公告)号：US10604646B2

公开(公告)日：2020-03-31

申请号：US16300991

申请日：2017-05-25

申请人： SABIC Global Technologies B.V.

发明人： Jian Wang ,  Shijie Song ,  Zhenke Wei ,  Qin Wang ,  Mian Dai

IPC分类号： C08K7/14 ,  C08L23/12 ,  C08L23/08 ,  C08L69/00 ,  C08L71/12 ,  C08L67/02 ,  C08L53/02 ,  C08L25/08

摘要： A thermoplastic composition includes from about 50 wt. % to about 90 wt. % of a polymeric base resin and from about 10 wt. % to about 50 wt. % of a low dielectric constant (Dk)/low dissipation factor (Df) glass fiber component. The low Dk/low Df glass fiber component has a Dk of less than about 5.0 at a frequency of from 1 MHz to 1 GHz and a Df of less than about 0.002 at a frequency of from 1 MHz to 1 GHz. In certain aspects the thermoplastic composition has a Dk that is at least about 0.1 lower than a substantially identical reference composition that does not include the low Dk/low Df glass fiber component.

公开(公告)号：US10557035B2

公开(公告)日：2020-02-11

申请号：US15752908

申请日：2016-07-21

申请人： SABIC Global Technologies B.V.

发明人： Jian Wang ,  Shijie Song

IPC分类号： C08L71/12 ,  C08L25/06 ,  C08L53/02 ,  C08K3/22 ,  B29C48/00 ,  C08K3/014 ,  C08K3/30

摘要： Disclosed are resin compositions that include poly(arylene ether), HIPS/GPPS), impact modifier, and ceramic filer that provide various Dk values while maintaining Df at a very low level. The compositions also possess excellent mechanical and processing performance, for example, superior high impact strength and good ductility, compared to prior art compositions. The compositions can be used to form components of wireless electronic communications devices in order to ensure a low degree of signal attenuation.

公开(公告)号：US10647840B2

公开(公告)日：2020-05-12

申请号：US16300991

申请日：2017-05-25

申请人： SABIC Global Technologies B.V.

发明人： Jian Wang ,  Shijie Song ,  Zhenke Wei ,  Qin Wang ,  Mian Dai

IPC分类号： C08K7/14 ,  C08L23/12 ,  C08L23/08 ,  C08L69/00 ,  C08L71/12 ,  C08L67/02 ,  C08L53/02 ,  C08L25/08

摘要： A thermoplastic composition includes from about 50 wt. % to about 90 wt. % of a polymeric base resin and from about 10 wt. % to about 50 wt. % of a low dielectric constant (Dk)/low dissipation factor (Df) glass fiber component. The low Dk/low Df glass fiber component has a Dk of less than about 5.0 at a frequency of from 1 MHz to 1 GHz and a Df of less than about 0.002 at a frequency of from 1 MHz to 1 GHz. In certain aspects the thermoplastic composition has a Dk that is at least about 0.1 lower than a substantially identical reference composition that does not include the low Dk/low Df glass fiber component.