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    Silicon based optical vias
    1.
    发明申请
    Silicon based optical vias 有权
    硅基光通孔

    公开(公告)号：US20100322551A1

    公开(公告)日：2010-12-23

    申请号：US12080266

    申请日：2008-04-01

    申请人： Russell A. Budd ,  Punit P. Chiniwalla ,  Chirag S. Patel

    发明人： Russell A. Budd ,  Punit P. Chiniwalla ,  Chirag S. Patel

    IPC分类号： G02B6/12 ,  H01L33/58

    CPC分类号： G02B6/4206 ,  G02B6/4214 ,  H01L33/58 ,  H01S5/005 ,  H01S5/02248 ,  H01S5/02288 ,  H01S5/183

    摘要： Method of fabricating a semiconductor die with a microlens associated therewith. More particularly, a method for fabricating a vertical channel guide optical via through a silicon substrate wherein the optical via can contain lens elements, a discrete index gradient guiding pillar and other embodiments. Also disclosed are means for transferring, coupling and or focusing light from an electronic-optical device on the top of a semiconductor substrate through the substrate to a waveguiding medium below the substrate. The high alignment accuracies afforded by standard semiconductor fabrication processes are exploited so as to obviate the need for active alignment of the optical coupling or light guiding elements.

    摘要翻译： 制造具有与之相关联的微透镜的半导体管芯的方法。 更具体地，涉及一种通过硅衬底制造垂直沟道引导光通孔的方法，其中光通孔可以包含透镜元件，离散折射率梯度引导柱和其它实施例。 还公开了用于将来自半导体衬底顶部的电子光学器件的光通过衬底转移，耦合和聚焦到衬底下面的波导介质的装置。 利用由标准半导体制造工艺提供的高对准精度，以便消除对光学耦合或导光元件的主动对准的需要。

    Silicon based optical vias
    2.
    发明授权
    Silicon based optical vias 有权
    硅基光通孔

    公开(公告)号：US08755644B2

    公开(公告)日：2014-06-17

    申请号：US12080266

    申请日：2008-04-01

    申请人： Russell A. Budd ,  Punit P. Chiniwalla ,  Chirag S. Patel

    发明人： Russell A. Budd ,  Punit P. Chiniwalla ,  Chirag S. Patel

    IPC分类号： G02B6/12 ,  H01L21/00 ,  H01L23/48

    CPC分类号： G02B6/4206 ,  G02B6/4214 ,  H01L33/58 ,  H01S5/005 ,  H01S5/02248 ,  H01S5/02288 ,  H01S5/183

    摘要： Method of fabricating a semiconductor die with a microlens associated therewith. More particularly, a method for fabricating a vertical channel guide optical via through a silicon substrate wherein the optical via can contain lens elements, a discrete index gradient guiding pillar and other embodiments. Also disclosed are means for transferring, coupling and or focusing light from an electronic-optical device on the top of a semiconductor substrate through the substrate to a waveguiding medium below the substrate. The high alignment accuracies afforded by standard semiconductor fabrication processes are exploited so as to obviate the need for active alignment of the optical coupling or light guiding elements.

    摘要翻译： 制造具有与之相关联的微透镜的半导体管芯的方法。 更具体地，涉及一种通过硅衬底制造垂直沟道引导光通孔的方法，其中光通孔可以包含透镜元件，离散折射率梯度引导柱和其它实施例。 还公开了用于将来自半导体衬底顶部的电子光学器件的光通过衬底转移，耦合和聚焦到衬底下面的波导介质的装置。 利用由标准半导体制造工艺提供的高对准精度，以便消除对光学耦合或导光元件的主动对准的需要。

    Silicon based optical vias
    3.
    发明授权
    Silicon based optical vias 有权
    硅基光通孔

    公开(公告)号：US07352066B2

    公开(公告)日：2008-04-01

    申请号：US10675139

    申请日：2003-09-30

    申请人： Russell A. Budd ,  Punit P. Chiniwalla ,  Chirag S. Patel

    发明人： Russell A. Budd ,  Punit P. Chiniwalla ,  Chirag S. Patel

    IPC分类号： H01L23/48

    CPC分类号： G02B6/43 ,  H01L23/481 ,  H01L2924/0002 ,  H05K1/0274 ,  H01L2924/00

    摘要： Method of fabricating a semiconductor die with a microlens associated therewith. More particularly, a method for fabricating a vertical channel guide optical via through a silicon substrate wherein the optical via can contain lens elements, a discrete index gradient guiding pillar and other embodiments. Also disclosed are means for transferring, coupling and or focusing light from an electronic-optical device on the top of a semiconductor substrate through the substrate to a waveguiding medium below the substrate. The high alignment accuracies afforded by standard semiconductor fabrication processes are exploited so as to obviate the need for active alignment of the optical coupling or light guiding elements.

    摘要翻译： 制造具有与之相关联的微透镜的半导体管芯的方法。 更具体地，涉及一种通过硅衬底制造垂直沟道引导光通孔的方法，其中光通孔可以包含透镜元件，离散折射率梯度引导柱和其它实施例。 还公开了用于将来自半导体衬底顶部的电子光学器件的光通过衬底转移，耦合和聚焦到衬底下面的波导介质的装置。 利用由标准半导体制造工艺提供的高对准精度，以便消除对光学耦合或导光元件的主动对准的需要。

    Medium containing optical paths and electrically conducting paths for applications in high speed data links
    8.
    发明授权
    Medium containing optical paths and electrically conducting paths for applications in high speed data links 失效
    介质包含用于高速数据链路中的光路和导电路径

    公开(公告)号：US07367715B1

    公开(公告)日：2008-05-06

    申请号：US11689788

    申请日：2007-03-22

    申请人： Russell A. Budd ,  Punit P. Chiniwalla ,  Derek B. Dove ,  James L. Sanford

    发明人： Russell A. Budd ,  Punit P. Chiniwalla ,  Derek B. Dove ,  James L. Sanford

    IPC分类号： G02B6/36 ,  G02B6/44 ,  G02B6/10

    CPC分类号： G02B6/4214 ,  G02B6/4249 ,  H05K1/0274

    摘要： A structure that possesses the combined properties of carrying signals through the provision of a series of electrical conductors, and by optical signals through the intermediary of a series of optical waveguides. This imparts a particular advantage thereto for the fabrication of optical data links, providing a convenient, compact method of interconnecting electrical paths to transducer chips and to waveguide structures. This approach solves the problem of connecting polymer waveguides to VCSEL (Vertical-Cavity-Surface-Emitting Laser) arrays, thereby avoiding the problem of damaging fragile wire bonds. A method is also provided which utilizes the foregoing structure.

    摘要翻译： 具有通过提供一系列电导体携带信号和通过一系列光波导中介的光信号的组合特性的结构。 这为光学数据链路的制造提供了特别的优点，提供了将电路互连到换能器芯片和波导结构的方便，紧凑的方法。 这种方法解决了将聚合物波导连接到VCSEL（垂直腔表面发射激光）阵列的问题，从而避免了损坏脆弱的引线键的问题。 还提供了利用上述结构的方法。

    Chip to Chip optical interconnect
    9.
    发明授权
    Chip to Chip optical interconnect 失效
    芯片到芯片光互连

    公开(公告)号：US07480429B1

    公开(公告)日：2009-01-20

    申请号：US11770299

    申请日：2007-06-28

    申请人： Punit P. Chiniwalla ,  Philip Hobbs ,  Theodore G. van Kessel

    发明人： Punit P. Chiniwalla ,  Philip Hobbs ,  Theodore G. van Kessel

    IPC分类号： G02B6/34 ,  H04J14/02

    CPC分类号： G02B6/124 ,  G02B6/1228 ,  G02B6/43

    摘要： An apparatus for optical communication is provided. The apparatus includes a first waveguide formed on a first surface and a second waveguide formed on a second surface. The first and second surfaces are bonded together to form an air gap between the first and second surfaces and diffraction gratings of the first and second waveguides are facing each other. A third waveguide is formed on a third surface, and the third surface is bonded to the second surface so an air gap exists between the third and second surface and diffraction gratings of the third and second wave guides face each other. The light beam passes from the second wave guide across the air gap and into the third waveguide.

    摘要翻译： 提供了一种用于光通信的装置。 该装置包括形成在第一表面上的第一波导和形成在第二表面上的第二波导。 第一和第二表面结合在一起以在第一和第二表面之间形成气隙，并且第一和第二波导的衍射光栅彼此面对。 第三波导形成在第三表面上，并且第三表面结合到第二表面，使得在第三和第二表面之间存在气隙，并且第三和第二波导的衍射光栅彼此面对。 光束从第二波导穿过气隙并进入第三波导。

    CHIP TO CHIP OPTICAL INTERCONNECT
    10.
    发明申请
    CHIP TO CHIP OPTICAL INTERCONNECT 失效
    芯片切割光纤互连

    公开(公告)号：US20090003762A1

    公开(公告)日：2009-01-01

    申请号：US11770299

    申请日：2007-06-28

    申请人： Punit P. Chiniwalla ,  Philip Hobbs ,  Theodore G. van Kessel

    发明人： Punit P. Chiniwalla ,  Philip Hobbs ,  Theodore G. van Kessel

    IPC分类号： G02B6/12

    CPC分类号： G02B6/124 ,  G02B6/1228 ,  G02B6/43

    摘要： An apparatus for optical communication is provided. The apparatus includes a first waveguide formed on a first surface and a second waveguide formed on a second surface. The first and second surfaces are bonded together to form an air gap between the first and second surfaces and diffraction gratings of the first and second waveguides are facing each other

    摘要翻译： 提供了一种用于光通信的装置。 该装置包括形成在第一表面上的第一波导和形成在第二表面上的第二波导。 第一和第二表面结合在一起以在第一和第二表面之间形成气隙，并且第一和第二波导的衍射光栅彼此面对