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公开(公告)号：US07692286B1
公开(公告)日：2010-04-06
申请号：US12221797
申请日：2008-08-05
申请人： Ronald Patrick Huemoeller , Russ Lie , David Hiner
发明人： Ronald Patrick Huemoeller , Russ Lie , David Hiner
IPC分类号： H01L23/12
CPC分类号： H01L24/96 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/76802 , H01L21/76877 , H01L21/78 , H01L21/82 , H01L23/3157 , H01L23/481 , H01L23/5389 , H01L24/19 , H01L24/97 , H01L2221/68345 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2224/82
摘要： A method of forming an electronic component package includes: forming electrically conductive traces for connecting first selected bond pads of a plurality of bond pads on a first surface of an electronic component to corresponding bonding locations formed on a second surface of the electronic component; coupling the first surface of the electronic component to a first surface of a lower dielectric strip; coupling the second surface of the electronic component to a first surface of an upper dielectric strip; forming lower via apertures through the lower dielectric strip to expose second selected bond pads of the plurality of bond pads on the first surface of the electronic component; forming upper via apertures through the upper dielectric strip to expose the bonding locations on the second surface of the electronic component; filling the lower and upper via apertures with an electrically conductive material to form lower and upper vias electrically coupled to the first and second selected bond pads of the plurality of bond pads on the first surface of the electronic component.
摘要翻译： 形成电子部件封装的方法包括：形成导电迹线，用于将电子部件的第一表面上的多个接合焊盘的第一选定接合焊盘连接到形成在电子部件的第二表面上的相应接合位置; 将所述电子部件的第一表面耦合到下介电条的第一表面; 将所述电子部件的第二表面耦合到所述上介质条的第一表面; 通过所述下介电条形成下通孔，以暴露所述电子部件的第一表面上的多个接合焊盘的第二选定接合焊盘; 通过所述上介质条形成上通孔以暴露所述电子部件的第二表面上的接合位置; 用导电材料填充下通孔和上通孔，以形成电耦合到电子部件的第一表面上的多个接合焊盘的第一和第二选定接合焊盘的下通孔和上通孔。
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公开(公告)号：US07420272B1
公开(公告)日：2008-09-02
申请号：US11784979
申请日：2007-04-09
申请人： Ronald Patrick Huemoeller , Russ Lie , David Hiner
发明人： Ronald Patrick Huemoeller , Russ Lie , David Hiner
IPC分类号： H01L23/12
CPC分类号： H01L24/96 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/76802 , H01L21/76877 , H01L21/78 , H01L21/82 , H01L23/3157 , H01L23/481 , H01L23/5389 , H01L24/19 , H01L24/97 , H01L2221/68345 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2224/82
摘要： A method of forming an electronic component package includes: forming electrically conductive traces for connecting first selected bond pads of a plurality of bond pads on a first surface of an electronic component to corresponding bonding locations formed on a second surface of the electronic component; coupling the first surface of the electronic component to a first surface of a lower dielectric strip; coupling the second surface of the electronic component to a first surface of an upper dielectric strip; forming lower via apertures through the lower dielectric strip to expose second selected bond pads of the plurality of bond pads on the first surface of the electronic component; forming upper via apertures through the upper dielectric strip to expose the bonding locations on the second surface of the electronic component; filling the lower and upper via apertures with an electrically conductive material to form lower and upper vias electrically coupled to the first and second selected bond pads of the plurality of bond pads on the first surface of the electronic component.
摘要翻译： 形成电子部件封装的方法包括：形成导电迹线，用于将电子部件的第一表面上的多个接合焊盘的第一选定接合焊盘连接到形成在电子部件的第二表面上的相应接合位置; 将所述电子部件的第一表面耦合到下介电条的第一表面; 将所述电子部件的第二表面耦合到所述上介质条的第一表面; 通过所述下介电条形成下通孔，以暴露所述电子部件的第一表面上的多个接合焊盘的第二选定接合焊盘; 通过所述上介质条形成上通孔以暴露所述电子部件的第二表面上的接合位置; 用导电材料填充下通孔和上通孔，以形成电耦合到电子部件的第一表面上的多个接合焊盘的第一和第二选定接合焊盘的下通孔和上通孔。
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公开(公告)号：US07247523B1
公开(公告)日：2007-07-24
申请号：US11047848
申请日：2005-01-31
申请人： Ronald Patrick Huemoeller , Russ Lie , David Hiner
发明人： Ronald Patrick Huemoeller , Russ Lie , David Hiner
IPC分类号： H01L21/00
CPC分类号： H01L24/96 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/76802 , H01L21/76877 , H01L21/78 , H01L21/82 , H01L23/3157 , H01L23/481 , H01L23/5389 , H01L24/19 , H01L24/97 , H01L2221/68345 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2224/82
摘要： A method of forming an electronic component package includes: forming electrically conductive traces for connecting first selected bond pads of a plurality of bond pads on a first surface of an electronic component to corresponding bonding locations formed on a second surface of the electronic component; coupling the first surface of the electronic component to a first surface of a lower dielectric strip; coupling the second surface of the electronic component to a first surface of an upper dielectric strip; forming lower via apertures through the lower dielectric strip to expose second selected bond pads of the plurality of bond pads on the first surface of the electronic component; forming upper via apertures through the upper dielectric strip to expose the bonding locations on the second surface of the electronic component; filling the lower and upper via apertures with an electrically conductive material to form lower and upper vias electrically coupled to the first and second selected bond pads of the plurality of bond pads on the first surface of the electronic component.
摘要翻译： 形成电子部件封装的方法包括：形成导电迹线，用于将电子部件的第一表面上的多个接合焊盘的第一选定接合焊盘连接到形成在电子部件的第二表面上的相应接合位置; 将所述电子部件的第一表面耦合到下介电条的第一表面; 将所述电子部件的第二表面耦合到所述上介质条的第一表面; 通过所述下介电条形成下通孔，以暴露所述电子部件的第一表面上的多个接合焊盘的第二选定接合焊盘; 通过所述上介质条形成上通孔以暴露所述电子部件的第二表面上的接合位置; 用导电材料填充下通孔和上通孔，以形成电耦合到电子部件的第一表面上的多个接合焊盘的第一和第二选定接合焊盘的下通孔和上通孔。
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公开(公告)号：US08316536B1
公开(公告)日：2012-11-27
申请号：US12151857
申请日：2008-05-09
IPC分类号： H01K3/10
CPC分类号： H01L24/73 , H01L21/4857 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/1815 , H05K1/056 , H05K3/0032 , H05K3/0035 , H05K3/107 , H05K3/1258 , H05K3/423 , H05K7/1061 , H05K2201/09036 , H05K2201/09554 , H05K2203/0723 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A method of making a semiconductor package substrate includes laser-ablating channels in the substrate. After the channels are ablated in the substrate, conductive material is added to fill the channels and cover the surface of the substrate. Then a photomask etching process simultaneously forms a circuit pattern above the surface of the substrate and removes excess metal above the channels, by removing metal above the surface only in patterned regions. The result is a two-level circuit pattern having conductors within and above the substrate.
摘要翻译： 制造半导体封装衬底的方法包括在衬底中的激光烧蚀通道。 在衬底中消融通道之后，加入导电材料以填充通道并覆盖衬底的表面。 然后，光掩模蚀刻工艺同时在衬底的表面上形成电路图案，并且通过仅在图案化区域中去除表面上方的金属，去除通道上方的多余金属。 结果是在衬底内和上方具有导体的两电平电路图案。
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