公开(公告)号：US11860184B2

公开(公告)日：2024-01-02

申请号：US17447876

申请日：2021-09-16

Applicant: Robert Bosch GmbH

Inventor： Cristian Nagel ,  Johannes Classen ,  Lars Tebje ,  Rolf Scheben ,  Rudy Eid

IPC: G01P15/08 ,  G01P15/125 ,  B81B3/00

CPC classification number: G01P15/0802 ,  B81B3/001 ,  B81B3/0051 ,  G01P15/125 ,  B81B2201/0235 ,  B81B2203/0163 ,  B81B2203/04 ,  G01P2015/0831 ,  G01P2015/0862 ,  G01P2015/0871

Abstract: A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.

公开(公告)号：US20140021515A1

公开(公告)日：2014-01-23

申请号：US13942744

申请日：2013-07-16

Applicant: Robert Bosch GmbH

Inventor： Johannes Classen ,  Miko Hattass ,  Lars Tebje ,  Daniel Christoph Meisel

IPC: B81B7/00

CPC classification number: B81B7/008 ,  B81B2201/0235 ,  B81C1/00246 ,  B81C2203/0735 ,  B81C2203/0771 ,  B81C2203/0792 ,  G01P2015/0877

Abstract: A micromechanical structure, in particular a sensor arrangement, includes at least one micromechanical functional layer, a CMOS substrate region arranged below the at least one micromechanical functional layer, and an arrangement of one or more contact elements. The CMOS substrate region has at least one configurable circuit arrangement. The arrangement of one or more contact elements is arranged between the at least one micromechanical functional layer and the CMOS substrate region and is electrically connected to the micromechanical functional layer and the circuit arrangement. The configurable circuit arrangement is designed in such a way that the one or more contact elements are configured to be selectively connected to electrical connection lines in the CMOS substrate region.

Abstract translation: 微机械结构，特别是传感器装置，包括至少一个微机械功能层，布置在至少一个微机械功能层下方的CMOS衬底区域以及一个或多个接触元件的布置。 CMOS衬底区域具有至少一个可配置电路布置。 一个或多个接触元件的布置被布置在至少一个微机械功能层和CMOS衬底区域之间，并且电连接到微机械功能层和电路装置。 可配置电路布置被设计成使得一个或多个接触元件被配置为选择性地连接到CMOS衬底区域中的电连接线。

公开(公告)号：US20200241035A1

公开(公告)日：2020-07-30

申请号：US16748911

申请日：2020-01-22

Applicant: Robert Bosch GmbH

Inventor： Johannes Classen ,  Lars Tebje

IPC: G01P15/125 ,  G01P15/18 ,  G01P1/00

Abstract: A micromechanical inertial sensor, having a substrate; and a seismic mass which is connected to the substrate and developed so that it has a detection capability of a low-g acceleration of approximately 1 g in a first Cartesian coordinate direction, and the seismic mass is furthermore developed so that it has a detection capability of a high-g acceleration of at least approximately 100 g in at least one second Cartesian coordinate direction.

公开(公告)号：US20190383852A1

公开(公告)日：2019-12-19

申请号：US16433084

申请日：2019-06-06

Applicant: Robert Bosch GmbH

Inventor： Lars Tebje ,  Amin Jemili ,  Christian Marschall

IPC: G01P15/125

Abstract: A method for operating a micromechanical inertial sensor, including: translating an acceleration into a deflection of two detection electrodes that are displaced in opposite directions; ascertaining a difference in the spacing of the two detection electrodes; converting the difference in the spacing into an acceleration value using a scaling factor; and applying a linearization process to the acceleration value.

公开(公告)号：US20170081177A1

公开(公告)日：2017-03-23

申请号：US15311253

申请日：2015-05-29

Applicant: Robert Bosch GmbH

Inventor： Reinhard Neul ,  Johannes Classen ,  Torsten Kramer ,  Jochen Reinmuth ,  Mirko Hattass ,  Lars Tebje ,  Daniel Christoph Meisel ,  Ralf Reichenbach ,  Friedjof Heuck ,  Antoine Puygranier

IPC: B81B7/00

CPC classification number: B81B7/0048 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/096 ,  H01L23/13 ,  H01L23/49827 ,  H01L2224/16225

Abstract: An interposer is provided which is made up of a flat carrier substrate including at least one front wiring plane, in which front terminal pads are formed for mounting a component on the interposer, including at least one rear wiring plane, in which rear terminal pads are formed for mounting on a component carrier, the front terminal pads and the rear terminal pads being arranged offset from each other; and including vias for electrical connection of the at least one front wiring plane and the at least one rear wiring plane. The carrier substrate includes at least one edge section and at least one center section, which are at least largely mechanically decoupled via a stress-decoupling structure. The front terminal pads are arranged exclusively on the center section for mounting the component, while the rear terminal pads are arranged exclusively on the edge section for mounting on a component carrier.

公开(公告)号：US09428378B2

公开(公告)日：2016-08-30

申请号：US14731032

申请日：2015-06-04

Applicant: Robert Bosch GmbH

Inventor： Friedjof Heuck ,  Lars Tebje ,  Heiko Stahl ,  Jullian Gonska ,  Reinhard Neul

IPC: H01L23/00 ,  B81B7/00 ,  B81C1/00 ,  B81B7/02 ,  H01L23/02 ,  H01L23/10 ,  H01L21/50

CPC classification number: B81B7/0038 ,  B81B7/02 ,  B81B2203/0315 ,  B81C1/00285 ,  B81C2203/0145 ,  H01L21/50 ,  H01L23/02 ,  H01L23/10 ,  H01L2224/48463

Abstract: For the targeted influencing of the internal pressure within a cavity between two elements of a component, a getter material or an outgassing material is situated in an additional cavity between the two elements. After the two elements are bonded to one another, the additional cavity is still to be joined via a connecting opening to the cavity. The getter material or the outgassing material is then activated so that gasses are bound in the additional cavity and in the connected cavity, or an outgassing takes place. Only when the sought internal pressure has established itself in the connected cavity is the connecting opening to the additional cavity closed. In this way, the getter material or the outgassing material is only used for establishing a defined internal pressure, but no longer has any influence on the internal pressure within the cavity during ongoing operation of the component.

公开(公告)号：US12181356B2

公开(公告)日：2024-12-31

申请号：US17641593

申请日：2020-09-04

Applicant: Robert Bosch GmbH

Inventor： Lars Tebje ,  Jochen Reinmuth ,  Johannes Classen

IPC: G01L19/00 ,  G01L9/00 ,  G01L13/02 ,  G01P1/00 ,  G01P15/125

Abstract: A micromechanical component for a pressure and inertial sensor device. The component includes a substrate having an upper substrate surface; a diaphragm having an inner diaphragm side oriented towards the upper substrate surface and an outer diaphragm side pointing away from the upper substrate surface, the inner diaphragm side bordering on an inner volume, in which a reference pressure is enclosed, and the diaphragm being able to be warped using a pressure difference between a pressure prevailing on its outer diaphragm side and the reference pressure; and a seismic mass situated in the inner volume, a sensor electrode, which projects out on the inner diaphragm side and extends into the inner volume, being displaceable with respect to the substrate due to a warping of the diaphragm. A pressure and inertial sensor device, and a method of manufacturing a micromechanical component for a pressure and inertial sensor device, are also described.

公开(公告)号：US12031820B2

公开(公告)日：2024-07-09

申请号：US17393629

申请日：2021-08-04

Applicant: Robert Bosch GmbH

Inventor： Lars Tebje ,  Johannes Classen ,  Christof Schwenk ,  Holger Rumpf ,  Joerg Braeuer ,  Torsten Ohms

IPC: G01C19/5656 ,  G01P1/00

CPC classification number: G01C19/5656 ,  G01P1/003

Abstract: A micromechanical system which includes a movably suspended mass. The micromechanical system includes a damping system, the damping system including a movably suspended damping structure, the damping structure being deflectable by applying a voltage. The damping structure is designed in such a way that a frequency response and/or a damping of the movably suspended mass are/is changeable with the aid of a deflection of the damping structure.

公开(公告)号：US10775170B2

公开(公告)日：2020-09-15

申请号：US15253345

申请日：2016-08-31

Applicant: Robert Bosch GmbH

Inventor： Joerg Braeuer ,  Christian Hoeppner ,  Lars Tebje

IPC: G01C19/5712 ,  B81C1/00 ,  B81B7/00 ,  B81B3/00

Abstract: A method for manufacturing a MEMS element, including the following: forming a least one stationary weight element and at least one moving weight element in the MEMS element, and positioning at least one fixing element at the stationary weight element and at the moving weight element, the fixing element being formed so as to be able to be severed.

公开(公告)号：US20150353346A1

公开(公告)日：2015-12-10

申请号：US14731032

申请日：2015-06-04

Applicant: Robert Bosch GmbH

Inventor： Friedjof HEUCK ,  Lars Tebje ,  Heiko Stahl ,  Jullian Gonska ,  Reinhard Neul

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0038 ,  B81B7/02 ,  B81B2203/0315 ,  B81C1/00285 ,  B81C2203/0145 ,  H01L21/50 ,  H01L23/02 ,  H01L23/10 ,  H01L2224/48463

Abstract: For the targeted influencing of the internal pressure within a cavity between two elements of a component, a getter material or an outgassing material is situated in an additional cavity between the two elements. After the two elements are bonded to one another, the additional cavity is still to be joined via a connecting opening to the cavity. The getter material or the outgassing material is then activated so that gasses are bound in the additional cavity and in the connected cavity, or an outgassing takes place. Only when the sought internal pressure has established itself in the connected cavity is the connecting opening to the additional cavity closed. In this way, the getter material or the outgassing material is only used for establishing a defined internal pressure, but no longer has any influence on the internal pressure within the cavity during ongoing operation of the component.

Abstract translation: 为了有针对性地影响组件的两个元件之间的腔内的内部压力，吸气剂材料或除气材料位于两个元件之间的附加空腔中。 在两个元件彼此接合之后，附加空腔仍然通过连接开口连接到空腔。 吸气剂材料或除气材料然后被激活，使得气体结合在附加空腔中和在连接的空腔中，或者发生脱气。 只有当所寻求的内部压力已经建立在连接的空腔中时，才是关闭附加空腔的连接开口。 以这种方式，吸气剂材料或除气材料仅用于建立限定的内部压力，但是在组件的正在运行期间不再对空腔内部的内部压力产生任何影响。