公开(公告)号：US09754850B2

公开(公告)日：2017-09-05

申请号：US15110907

申请日：2014-12-02

Applicant: Robert Bosch GmbH

Inventor： Isabel Faria ,  Peter Pfeiffer ,  Heiko Elsinger ,  Andre Hahn

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  C09D183/04 ,  H01L23/26 ,  C08G77/12 ,  C08G77/20 ,  C08K3/22 ,  C08K3/26

CPC classification number: H01L23/295 ,  C08G77/12 ,  C08G77/20 ,  C08K2003/2227 ,  C08K2003/265 ,  C08K2003/267 ,  C08K2201/003 ,  C08K2201/005 ,  C09D183/04 ,  H01L21/563 ,  H01L23/26 ,  H01L23/296 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/32 ,  H01L2224/29611 ,  H01L2224/32225 ,  H01L2924/0002 ,  H01L2924/186 ,  C08L83/00 ,  H01L2924/00 ,  C08K3/26

Abstract: A circuit carrier. The circuit carrier has at least one electronic component, the electronic component being soldered to the circuit carrier, in particular with the aid of a flux. The circuit carrier has, in particular, an electrically insulating protective layer for anti-condensation, a surface of the circuit carrier being covered at least partially with the protective layer. The protective layer of the circuit carrier is formed by a silicon polymer layer designed to be activatable with the aid of ultraviolet radiation, the silicon polymer layer having filler particles distributed in the silicon polymer layer, in particular homogenously. At least a part of the filler particles or all filler particles have at least one salt of an alkaline earth metal.

公开(公告)号：US20160329259A1

公开(公告)日：2016-11-10

申请号：US15110907

申请日：2014-12-02

Applicant: ROBERT BOSCH GMBH

Inventor： Isabel Faria ,  Peter Pfeiffer ,  Heiko Elsinger ,  Andre Hahn

IPC: H01L23/29 ,  H01L23/00 ,  H01L21/56 ,  C09D183/04 ,  H01L23/31

CPC classification number: H01L23/295 ,  C08G77/12 ,  C08G77/20 ,  C08K2003/2227 ,  C08K2003/265 ,  C08K2003/267 ,  C08K2201/003 ,  C08K2201/005 ,  C09D183/04 ,  H01L21/563 ,  H01L23/26 ,  H01L23/296 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/32 ,  H01L2224/29611 ,  H01L2224/32225 ,  H01L2924/0002 ,  H01L2924/186 ,  C08L83/00 ,  H01L2924/00 ,  C08K3/26

Abstract: A circuit carrier. The circuit carrier has at least one electronic component, the electronic component being soldered to the circuit carrier, in particular with the aid of a flux. The circuit carrier has, in particular, an electrically insulating protective layer for anti-condensation, a surface of the circuit carrier being covered at least partially with the protective layer. The protective layer of the circuit carrier is formed by a silicon polymer layer designed to be activatable with the aid of ultraviolet radiation, the silicon polymer layer having filler particles distributed in the silicon polymer layer, in particular homogenously. At least a part of the filler particles or all filler particles have at least one salt of an alkaline earth metal.

Abstract translation: 电路载体。 电路载体具有至少一个电子部件，电子部件特别是借助焊剂焊接到电路载体上。 电路载体尤其具有用于防冷凝的电绝缘保护层，电路载体的表面至少部分被保护层覆盖。 电路载体的保护层由设计成借助紫外线辐射激活的硅聚合物层形成，硅聚合物层具有分布在硅聚合物层中的填料颗粒，特别是均匀的。 至少一部分填料颗粒或所有填料颗粒具有至少一种碱土金属的盐。