公开(公告)号：US11072023B2

公开(公告)日：2021-07-27

申请号：US15423961

申请日：2017-02-03

Applicant: Raytheon Company

Inventor： Theodore J. Conrad ,  James R. Chow ,  Craig A. Armiento ,  William E. Elias

IPC: F25B9/14 ,  B22F9/24 ,  B01J19/12 ,  F28F13/18 ,  F28F21/02 ,  B22F1/00 ,  C09D11/037 ,  C09D11/322 ,  C09D11/52 ,  F25B9/00 ,  F28F19/02 ,  B41J2/01 ,  B33Y10/00 ,  B33Y80/00 ,  F28D21/00

Abstract: An apparatus includes a heat exchanger configured to transfer heat to a fluid and to absorb heat from the fluid as the fluid flows between a warm end and a cold end of a cryocooler. The heat exchanger includes at least one section having a substrate of at least one allotropic form of carbon and a layer of nanoparticles on or over the substrate. The heat exchanger could include multiple sections, and each section could include one of multiple substrates and one of multiple layers of nanoparticles. The heat exchanger can further include pores through the multiple sections of the heat exchanger, where the pores are configured to allow the fluid to flow through the heat exchanger and to contact the substrates and the layers of nanoparticles. The nanoparticles could include at least one lanthanide element or alloy, and the substrate could include carbon nanotubes or graphene.

公开(公告)号：US20180180329A9

公开(公告)日：2018-06-28

申请号：US15423961

申请日：2017-02-03

Applicant: Raytheon Company

Inventor： Theodore J. Conrad ,  James R. Chow ,  Craig A. Armiento ,  William E. Elias

IPC: F25B9/14 ,  B41J2/01 ,  B22F9/24 ,  B22F1/00 ,  B33Y10/00 ,  B33Y80/00 ,  F28F13/18 ,  F28F21/02

CPC classification number: F25B9/145 ,  B01J19/123 ,  B22F1/0018 ,  B22F9/24 ,  B22F2202/11 ,  B22F2999/00 ,  B33Y10/00 ,  B33Y80/00 ,  B41J2/01 ,  C09D11/037 ,  C09D11/322 ,  C09D11/52 ,  F25B9/00 ,  F25B2309/1412 ,  F25B2309/1415 ,  F28D2021/0033 ,  F28F13/18 ,  F28F13/185 ,  F28F19/02 ,  F28F21/02 ,  F28F2245/00 ,  F28F2255/20

Abstract: An apparatus includes a heat exchanger configured to transfer heat to a fluid and to absorb heat from the fluid as the fluid flows between a warm end and a cold end of a cryocooler. The heat exchanger includes at least one section having a substrate of at least one allotropic form of carbon and a layer of nanoparticles on or over the substrate. The heat exchanger could include multiple sections, and each section could include one of multiple substrates and one of multiple layers of nanoparticles. The heat exchanger can further include pores through the multiple sections of the heat exchanger, where the pores are configured to allow the fluid to flow through the heat exchanger and to contact the substrates and the layers of nanoparticles. The nanoparticles could include at least one lanthanide element or alloy, and the substrate could include carbon nanotubes or graphene.

公开(公告)号：US20230139276A1

公开(公告)日：2023-05-04

申请号：US17515870

申请日：2021-11-01

Applicant: Raytheon Company ,  The University of Massachusetts

Inventor： Craig A. Armiento ,  Yuri Piro ,  Andrew M. Luce ,  Emily Lamport ,  Oshadha Ranasingha ,  Christopher R. Areias ,  Christopher N. Kuncho ,  Alkim Akyurtlu ,  Edward D. Kingsley

IPC: H05K1/18 ,  H05K3/30 ,  C09D11/102 ,  C09D11/101 ,  C09D11/037

Abstract: A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.

公开(公告)号：US20230017655A1

公开(公告)日：2023-01-19

申请号：US17372907

申请日：2021-07-12

Applicant: Raytheon Company ,  The University of Massachusetts

Inventor： Yuri Piro ,  Christopher R. Areias ,  Andrew M. Luce ,  Oshadha Ranasingha ,  Emily Lamport ,  Alkim Akyurtlu ,  Edward D. Kingsley ,  Craig A. Armiento

IPC: C09D11/38 ,  C09D11/328 ,  C09D11/101 ,  C09D11/102 ,  C09D11/037 ,  B41M5/00 ,  B41J11/00

Abstract: A dielectric ink composition includes an epoxy precursor and a photoacid generator. The dielectric ink composition is aerosolable and ultraviolet (UV) curable.

公开(公告)号：US20230014456A1

公开(公告)日：2023-01-19

申请号：US17373083

申请日：2021-07-12

Applicant: Raytheon Company ,  The University of Massachusetts

Inventor： Christopher R. Areias ,  Yuri Piro ,  Andrew M. Luce ,  Guinevere M. Strack ,  Oshadha Ranasingha ,  Alkim Akyurtlu ,  Edward D. Kingsley ,  Craig A. Armiento

IPC: B29C64/112 ,  B29C64/129 ,  C09D11/52 ,  C09D11/101 ,  B33Y10/00 ,  B33Y40/10 ,  B29C64/205 ,  C09D11/102 ,  C09D11/03 ,  B33Y70/00 ,  C09D11/50

Abstract: A method of fabricating a three-dimensional (3D) object includes atomizing a pre-polymer composition into an aerosol jet stream. The pre-polymer composition includes an epoxy precursor and a photoacid generator. The method further includes depositing the aerosol jet stream onto a substrate to form a first layer of dielectric ink and curing the first layer of dielectric ink using ultraviolet (UV) light. The method further includes depositing the aerosol jet stream onto the first layer of dielectric ink to form a second layer of dielectric ink. The first layer of dielectric ink and the second layer of dielectric ink overlap by at least 50%.

公开(公告)号：US12096561B2

公开(公告)日：2024-09-17

申请号：US17515870

申请日：2021-11-01

Applicant: Raytheon Company ,  The University of Massachusetts

Inventor： Craig A. Armiento ,  Yuri Piro ,  Andrew M. Luce ,  Emily Lamport ,  Oshadha Ranasingha ,  Christopher R. Areias ,  Christopher N. Kuncho ,  Alkim Akyurtlu ,  Edward D. Kingsley

IPC: H05K1/18 ,  C09D11/037 ,  C09D11/101 ,  C09D11/102 ,  H05K3/30

CPC classification number: H05K1/183 ,  C09D11/037 ,  C09D11/101 ,  C09D11/102 ,  H05K3/30 ,  H05K2201/0112 ,  H05K2201/0137 ,  H05K2201/0209

Abstract: A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.

公开(公告)号：US20230113929A1

公开(公告)日：2023-04-13

申请号：US17938688

申请日：2022-10-07

Applicant: Raytheon Company ,  The University of Massachusetts

Inventor： Craig A. Armiento ,  Yuri Piro ,  Oshadha Ranasingha ,  Andrew M. Luce ,  Edward D. Kingsley ,  Alkim Akyurtlu

IPC: C09D11/54 ,  C09D11/52 ,  C09D11/107

Abstract: An ink stabilizing composition includes a polymeric network including an acrylate polymer and a plurality of high aspect ratio particles each having an aspect ratio of about 2:1 to about 30:1 and an average particle diameter of about 0.5 to about 1.2 micrometers.

公开(公告)号：US20220220331A1

公开(公告)日：2022-07-14

申请号：US17629798

申请日：2020-07-30

Applicant: University of Massachusetts ,  Raytheon Company

Inventor： Oshadha K. Ranasingha ,  Andrew M. Luce ,  Guinevere M. Strack ,  Mahdi Haghzadeh ,  Cameron Hardie ,  Edward Kingsley ,  Craig A. Armiento ,  Alkim Akyurtlu

IPC: C09D11/52 ,  C09D11/037 ,  C09D11/033 ,  B41J11/00

Abstract: This disclosure describes manufacture of a mixture and use of same to fabricate different types of electronic components. In one configuration, the mixture includes: first particles, the first particles being an insulator material; second particles, the second particles being electrically conductive metal material; and a combination of the first particles and the second particles suspended in a printable liquid medium, the printable liquid/solid medium (slurry) being curable into a dielectric layer of material. According to one configuration, the printable material is disposed and cured on a substrate. The first particles and second particles are randomly distributed in the cured printed material (dielectric material). The second particles in the cured dielectric material are transformable into one or more electrically conductive paths, electronic components, etc., via application of heat above a threshold value. Thus, a dielectric (insulator) material can be transformed into an electrically conductive path via application of heat.