Radome assembly
    1.
    发明授权

    公开(公告)号:US10454161B1

    公开(公告)日:2019-10-22

    申请号:US15061170

    申请日:2016-03-04

    Abstract: A low profile, low loss, wide band, wide scan volume radome assembly is provided for an antenna. The radome assembly includes a fabric radome element disposable over the antenna, first radome securing elements securably embedded within the fabric radome element and second radome securing elements securably embedded within the antenna. The second radome securing elements are respectively engageable with the first radome securing elements to thereby secure the fabric radome element over the antenna.

    Self-aligning radio frequency connector

    公开(公告)号:US11990715B2

    公开(公告)日:2024-05-21

    申请号:US17119988

    申请日:2020-12-11

    CPC classification number: H01R24/40 H01R13/6315

    Abstract: The present disclosure sets forth a rigid, self-aligning radio frequency (“RF”) connector comprising a rigid body with a first connection end and a second connection end opposite the first connection end. The RF connector can also comprise a recess disposed on an outer surface of the rigid body between the first and second connection ends, and a collapsible connector support that can comprise a connection portion and a collapsible portion. The collapsible connector support can be disposed within and protrude from the recess while also being configured to collapse into the recess. The collapsible connector support can also be configured to interface with an interfacing surface to facilitate generation of a reaction force sufficient to support the RF connector in an offset position relative to the interfacing surface and to nominally align the RF connector with a device to be connected.

    COMPONENT SUPPORT FOR DENSE CIRCUIT BOARD
    4.
    发明申请
    COMPONENT SUPPORT FOR DENSE CIRCUIT BOARD 有权
    电路板组件支持

    公开(公告)号:US20160270230A1

    公开(公告)日:2016-09-15

    申请号:US14644721

    申请日:2015-03-11

    Abstract: A support apparatus for a component is provided and includes a periphery entirely disposable within a footprint of the component on a surface of a substrate, a first portion having a first surface adhesively connectable to the component, a second portion having a second surface disposable to contact the surface of the substrate in discrete sectors and defining an aperture through which leads are extendable from the component and through the substrate, and vents extending between the discrete sectors from the aperture to the periphery, and bosses disposed to protrude from the second surface and into through-holes defined in the substrate.

    Abstract translation: 提供了一种用于部件的支撑装置,其包括在基板的表面上的部件的占地面积内的完全一次性的外围的第一部分,具有可与部件粘合地连接的第一表面的第一部分,具有一次性接触的第二表面的第二部分 衬底的表面在离散的扇区中并且限定了一个孔,通过该孔,引线可以从部件和基板延伸出来,并且在从孔到周边的离散扇区之间延伸的通风口以及从第二表面突出设置的凸起 通孔限定在基板中。

    Methodology for blindmating and cooling electronic modules

    公开(公告)号:US10939582B2

    公开(公告)日:2021-03-02

    申请号:US16824910

    申请日:2020-03-20

    Abstract: An apparatus is disclosed comprising: a chassis including an array plate, the array plate having a plurality of first openings formed thereon; a plurality of floating inserts, each of the floating inserts being disposed in a different one of the first openings; a main board having a plurality of second openings formed thereon, the main board being coupled to the array plate via a plurality of alignment pins, each of the alignment pins extending through a respective one of the plurality of floating inserts and into a respective one of the plurality of second openings; and an electronic module coupled to the main board, the electronic module including a first connector and at least one alignment socket, the first connector being coupled to a second connector that is disposed on the main board, the alignment socket being arranged to receive a given one of the alignment pins.

    Reverse wedgelock device
    7.
    发明授权
    Reverse wedgelock device 有权
    反向楔锁装置

    公开(公告)号:US09167714B2

    公开(公告)日:2015-10-20

    申请号:US13867931

    申请日:2013-04-22

    CPC classification number: H05K7/1404 H05K7/20545 Y10T29/49826

    Abstract: A reverse wedgelock device with multiple draw blocks disposed about a lead screw passing through the draw blocks, wherein the draw blocks may be compressed together and caused to displace about respective wedge surfaces upon tightening of the screw. Compression and displacement of the draw blocks can function to draw anchors associated with the draw blocks inward, which, when engaged with opposing objects, functions to draw the objects together.

    Abstract translation: 具有多个牵引块的反向楔形装置,其布置在穿过牵引块的导螺杆周围,其中牵引块可以被压缩在一起,并且在拧紧螺钉时围绕相应的楔形表面移位。 拉伸块的压缩和位移可以用于将与拉伸块相关联的锚定件向内拉,其在与相对的物体接合时用于将物体牵引在一起。

    Radome assembly
    8.
    发明授权

    公开(公告)号:US10862204B2

    公开(公告)日:2020-12-08

    申请号:US16594727

    申请日:2019-10-07

    Abstract: A low profile, low loss, wide band, wide scan volume radome assembly is provided for an antenna. The radome assembly includes a fabric radome element disposable over the antenna, first radome securing elements securably embedded within the fabric radome element and second radome securing elements securably embedded within the antenna. The second radome securing elements are respectively engageable with the first radome securing elements to thereby secure the fabric radome element over the antenna.

    METHODOLOGY FOR BLINDMATING AND COOLING ELECTRONIC MODULES

    公开(公告)号:US20200315063A1

    公开(公告)日:2020-10-01

    申请号:US16824910

    申请日:2020-03-20

    Abstract: An apparatus is disclosed comprising: a chassis including an array plate, the array plate having a plurality of first openings formed thereon; a plurality of floating inserts, each of the floating inserts being disposed in a different one of the first openings; a main board having a plurality of second openings formed thereon, the main board being coupled to the array plate via a plurality of alignment pins, each of the alignment pins extending through a respective one of the plurality of floating inserts and into a respective one of the plurality of second openings; and an electronic module coupled to the main board, the electronic module including a first connector and at least one alignment socket, the first connector being coupled to a second connector that is disposed on the main board, the alignment socket being arranged to receive a given one of the alignment pins.

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