知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

12 条记录 (耗时 0.017 秒)

    JETTING A HIGHLY REFLECTIVE LAYER ONTO AN LED ASSEMBLY
    1.
    发明申请
    JETTING A HIGHLY REFLECTIVE LAYER ONTO AN LED ASSEMBLY 有权
    将高反射层放置在LED组件上

    公开(公告)号：US20130105837A1

    公开(公告)日：2013-05-02

    申请号：US13284835

    申请日：2011-10-28

    申请人： R. Scott West

    发明人： R. Scott West

    IPC分类号： H01L33/60

    CPC分类号： H01L25/0753 ,  H01L33/46 ,  H01L33/502 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2933/0025 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A layer of Highly Reflective (HR) material is deposited by jetting microdots of the HR material in liquid form onto a substrate and then allowing the HR material to harden. In one example, the HR layer is the HR layer of a white LED assembly. The HR layer is jetted onto the substrate around LED dice of the assembly after die attach and wire bonding have been completed. The HR material can be made to flow laterally so that areas of the substrate under wire bonds are coated with HR material, so that HR material contacts side edges of the LED dice, and so that HR material contacts the inside side edge of a retaining ring. By jetting the HR material in this way, the amount of substrate that is not covered with HR material is reduced, thereby improving the light efficiency of the resulting LED assembly.

    摘要翻译： 通过将液体形式的HR材料的微粒喷射到基底上，然后使HR材料硬化来沉积一层高反射（HR）材料。 在一个示例中，HR层是白色LED组件的HR层。 在芯片附着和引线接合完成之后，将HR层喷射到组件的LED芯片周围的基板上。 可以使HR材料横向流动，使得在线接合处的基底区域涂覆有HR材料，使得HR材料接触LED骰子的侧边缘，并且使得HR材料接触保持环的内侧边缘 。 通过以这种方式喷射HR材料，减少了不被HR材料覆盖的基板的量，从而提高了所得LED组件的光效率。

    LED-Based Light Source Utilizing Asymmetric Conductors
    5.
    发明申请
    LED-Based Light Source Utilizing Asymmetric Conductors 有权
    基于LED的光源利用不对称导体

    公开(公告)号：US20120112220A1

    公开(公告)日：2012-05-10

    申请号：US13086310

    申请日：2011-04-13

    申请人： R. Scott West ,  Yan Chai

    发明人： R. Scott West ,  Yan Chai

    IPC分类号： H01L33/60

    CPC分类号： H01L33/486 ,  H01L33/46 ,  H01L33/502 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/00012

    摘要： A light source includes LED dies that are flip-chip mounted on a flexible plastic substrate. The LED dies are attached to the substrate using an asymmetric conductor material with deformable conducting particles sandwiched between surface mount contacts on the LED dies and traces on the substrate. A diffusively reflective material containing light scattering particles is used instead of expensive reflective cups to reflect light upwards that is emitted sideways from the LED dies. The diffusively reflective material is dispensed over the top surface of the substrate and contacts the side surfaces of the dies. The light scattering particles are spheres of titanium dioxide suspended in silicone. The light source is manufactured in a reel-to-reel process in which the asymmetric conductor material and the diffusively reflective material are cured simultaneously. A silicone layer of molded lenses including phosphor particles is also added over the mounted LED dies in the reel-to-reel process.

    摘要翻译： 光源包括倒装芯片安装在柔性塑料基板上的LED管芯。 使用不对称导体材料将LED管芯附着到基板上，可变形导电颗粒夹在LED管芯上的表面安装触点和基板上的迹线之间。 使用包含光散射粒子的漫反射材料代替昂贵的反射杯来反射从LED芯片侧向发射的光。 扩散反射材料被分配在基板的顶表面上并与模具的侧表面接触。 光散射颗粒是悬浮在硅酮中的二氧化钛的球体。 光源以卷对卷方式制造，其中不对称导体材料和漫反射材料同时固化。 包括磷光体颗粒的模制透镜的硅氧烷层也在卷对盘工艺中被添加到所安装的LED模具上。

    Micro-bead blasting process for removing a silicone flash layer
    6.
    发明授权
    Micro-bead blasting process for removing a silicone flash layer 有权
    用于去除硅胶闪光层的微珠喷砂工艺

    公开(公告)号：US08536605B2

    公开(公告)日：2013-09-17

    申请号：US13304769

    申请日：2011-11-28

    申请人： R. Scott West ,  Tao Tong ,  Mike Kwon

    发明人： R. Scott West ,  Tao Tong ,  Mike Kwon

    IPC分类号： H01L33/58 ,  B24C1/08

    CPC分类号： H01L33/56 ,  B24C1/003 ,  B24C1/04 ,  B24C3/322 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00014

    摘要： Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.

    摘要翻译： 使用压缩成型在金属芯印刷电路板上的LED阵列上形成透镜，留下覆盖接触焊盘的硅胶闪光层，这些接触焊盘将阵列连接到电源。 去除闪蒸层的方法包括在闪蒸层处喷射碳酸氢钠颗粒。 喷嘴位于闪光层顶表面三十毫米内。 从喷嘴出来的空气流以垂直于顶表面的五至三十度之间的角度指向顶表面。 将碳酸氢钠颗粒加入到空气流中，然后碰撞到硅氧烷闪蒸层的顶表面，直到去除接触垫横向上方的闪蒸层。 清洁的接触垫周围的硅树脂的边缘其后含有痕量的碳酸氢钠。

    Micro-Bead Blasting Process for Removing a Silicone Flash Layer
    7.
    发明申请
    Micro-Bead Blasting Process for Removing a Silicone Flash Layer 有权
    用于去除硅酮闪光层的微珠爆破过程

    公开(公告)号：US20130134459A1

    公开(公告)日：2013-05-30

    申请号：US13304769

    申请日：2011-11-28

    申请人： R. Scott West ,  Tao Tong ,  Mike Kwon

    发明人： R. Scott West ,  Tao Tong ,  Mike Kwon

    IPC分类号： H01L33/58 ,  B24C1/08

    CPC分类号： H01L33/56 ,  B24C1/003 ,  B24C1/04 ,  B24C3/322 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00014

    摘要： Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.

    摘要翻译： 使用压缩成型在金属芯印刷电路板上的LED阵列上形成透镜，留下覆盖接触焊盘的硅胶闪光层，这些接触焊盘将阵列连接到电源。 去除闪蒸层的方法包括在闪蒸层处喷射碳酸氢钠颗粒。 喷嘴位于闪光层顶表面三十毫米内。 从喷嘴出来的空气流以垂直于顶表面的五至三十度之间的角度指向顶表面。 将碳酸氢钠颗粒加入到空气流中，然后碰撞到硅氧烷闪蒸层的顶表面，直到去除接触垫横向上方的闪蒸层。 清洁的接触垫周围的硅树脂的边缘其后含有痕量的碳酸氢钠。

    Jetting a highly reflective layer onto an LED assembly
    9.
    发明授权
    Jetting a highly reflective layer onto an LED assembly 有权
    将高反射层喷射到LED组件上

    公开(公告)号：US09461023B2

    公开(公告)日：2016-10-04

    申请号：US13284835

    申请日：2011-10-28

    申请人： R. Scott West

    发明人： R. Scott West

    IPC分类号： H01L25/075 ,  H01L33/60 ,  H01L33/46

    CPC分类号： H01L25/0753 ,  H01L33/46 ,  H01L33/502 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2933/0025 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A layer of Highly Reflective (HR) material is deposited by jetting microdots of the HR material in liquid form onto a substrate and then allowing the HR material to harden. In one example, the HR layer is the HR layer of a white LED assembly. The HR layer is jetted onto the substrate around LED dice of the assembly after die attach and wire bonding have been completed. The HR material can be made to flow laterally so that areas of the substrate under wire bonds are coated with HR material, so that HR material contacts side edges of the LED dice, and so that HR material contacts the inside side edge of a retaining ring. By jetting the HR material in this way, the amount of substrate that is not covered with HR material is reduced, thereby improving the light efficiency of the resulting LED assembly.

    摘要翻译： 通过将液体形式的HR材料的微粒喷射到基底上，然后使HR材料硬化来沉积一层高反射（HR）材料。 在一个示例中，HR层是白色LED组件的HR层。 在芯片附着和引线接合完成之后，将HR层喷射到组件的LED芯片周围的基板上。 可以使HR材料横向流动，使得在线接合处的基底区域涂覆有HR材料，使得HR材料接触LED骰子的侧边缘，并且使得HR材料接触保持环的内侧边缘 。 通过以这种方式喷射HR材料，减少了不被HR材料覆盖的基板的量，从而提高了所得LED组件的光效率。