公开(公告)号：US20170129344A1

公开(公告)日：2017-05-11

申请号：US14934625

申请日：2015-11-06

Applicant: QUALCOMM Incorporated

Inventor： Simon Peter Islinger ,  Steven Daniel Niederhauser ,  Jonathan Beaver ,  Chang-Yu Huang ,  Mickel Bipin Budhia ,  Nicholas Athol Keeling ,  Hao Hao ,  Michael Le Gallais Kissin ,  Rafal Krzysztof Scibor ,  Johan Gabriel Samuelsson

IPC: B60L11/18 ,  H02J5/00

CPC classification number: B60L11/182 ,  B60L53/12 ,  H01F27/22 ,  H01F38/14 ,  H02J5/005 ,  H02J7/025 ,  H02J7/047 ,  H02J50/12 ,  H04B5/0037 ,  Y02T10/7005 ,  Y02T10/7072 ,  Y02T90/122 ,  Y02T90/14

Abstract: Methods and apparatuses for thermal dissipation in vehicle pads for wireless power transfer applications are provided. In some implementations, an apparatus for wirelessly receiving charging power is provided. The apparatus comprises at least one receive coil configured to wirelessly receive the charging power. The apparatus further comprises a plurality of electrical components configured to convert the charging power to a direct current. The apparatus further comprises a primary heat sink comprising a plurality of fins configured to dissipate heat generated by the plurality of electrical components. The plurality of fins are disposed adjacent to the plurality of electrical components. The apparatus further comprises at least one thermally conductive structure configured to physically connect at least some of the plurality of electrical components to the primary heat sink.

公开(公告)号：US09583253B2

公开(公告)日：2017-02-28

申请号：US14203289

申请日：2014-03-10

Applicant: QUALCOMM INCORPORATED

Inventor： Simon Peter Islinger

IPC: H01F27/02 ,  H02J7/00 ,  H01F27/26 ,  B60L11/18 ,  H05K5/02 ,  H02J5/00 ,  H01F38/14 ,  H01F41/00 ,  H01F41/04

CPC classification number: H01F27/266 ,  B60L11/182 ,  H01F38/14 ,  H01F41/005 ,  H01F41/04 ,  H02J7/025 ,  H02J50/12 ,  H02J50/40 ,  H02J50/90 ,  H05K5/0217 ,  Y10T29/4902

Abstract: Systems and methods for implementing interengagement structures for a ferrite tile assembly of an induction coil housing are described herein. One aspect of the subject matter described in the disclosure is a housing. The housing includes a base forming a receptacle. The housing further includes a ferrite tile assembly. The housing further includes an interengagement structure extending from the base and configured to secure the ferrite tile assembly relative to the base within the receptacle.

Abstract translation: 这里描述了用于实现感应线圈壳体的铁氧体瓷砖组件的相互接合结构的系统和方法。 在本公开中描述的主题的一个方面是外壳。 壳体包括形成容器的基座。 壳体还包括铁氧体瓦片组件。 壳体还包括从基部延伸并且被配置成相对于座中的基部固定铁氧体瓦片组件的相互接合结构。

公开(公告)号：US20160218534A1

公开(公告)日：2016-07-28

申请号：US15002204

申请日：2016-01-20

Applicant: QUALCOMM Incorporated

Inventor： Simon Peter Islinger ,  Steven Daniel Niederhauser

IPC: H02J7/00 ,  H02J5/00 ,  H02J7/02 ,  H02J50/10 ,  H01F41/06 ,  H01F38/14

CPC classification number: H02J7/0042 ,  B60L11/182 ,  B60L11/1829 ,  B60L11/1838 ,  B60M7/003 ,  H01F27/28 ,  H01F38/14 ,  H01F41/06 ,  H02J5/005 ,  H02J7/025 ,  H02J50/10 ,  H02J50/40 ,  Y02T10/7005 ,  Y02T10/7072 ,  Y02T90/121 ,  Y02T90/122 ,  Y02T90/125 ,  Y02T90/128 ,  Y02T90/14 ,  Y02T90/163

Abstract: A holder configured to hold one or more components of a wireless charging power transfer system is provided. The apparatus comprises a first surface having one or more grooves configured to receive at least a portion of a conductor of a coil that spans the holder and at least one other holder, the coil configured to inductively transfer power via a magnetic field. The apparatus comprises one or more mechanical connectors configured to fasten the holder to the at least one other holder. The apparatus further comprises a plurality of transverse grooves on the first surface that extend in a direction substantially perpendicular to a direction of extension of the one or more grooves, the plurality of transverse grooves configured to guide the conductor of the coil from the holder to the at least one other holder.

Abstract translation: 提供了一种被配置为保持无线充电电力传送系统的一个或多个组件的保持器。 该装置包括具有一个或多个凹槽的第一表面，该凹槽被配置为容纳跨过保持器的线圈的导体的至少一部分和至少一个其它保持器，该线圈被配置为经由磁场感应地传递功率。 该装置包括一个或多个机械连接器，其构造成将保持器固定到至少一个其它保持器。 所述装置还包括在所述第一表面上的多个横向槽，所述多个横向槽在基本上垂直于所述一个或多个槽的延伸方向的方向上延伸，所述多个横向槽被配置为将所述线圈的导体从所述保持器引导到 至少另一个持有人。

公开(公告)号：US10027147B2

公开(公告)日：2018-07-17

申请号：US15002204

申请日：2016-01-20

Applicant: QUALCOMM Incorporated

Inventor： Simon Peter Islinger ,  Steven Daniel Niederhauser

IPC: H01F38/14 ,  H02J50/10 ,  H02J50/40 ,  H01F41/06 ,  H01F27/28 ,  H02J7/00 ,  B60L11/18 ,  H02J5/00 ,  H02J7/02 ,  B60M7/00

Abstract: A holder configured to hold one or more components of a wireless charging power transfer system is provided. The apparatus comprises a first surface having one or more grooves configured to receive at least a portion of a conductor of a coil that spans the holder and at least one other holder, the coil configured to inductively transfer power via a magnetic field. The apparatus comprises one or more mechanical connectors configured to fasten the holder to the at least one other holder. The apparatus further comprises a plurality of transverse grooves on the first surface that extend in a direction substantially perpendicular to a direction of extension of the one or more grooves, the plurality of transverse grooves configured to guide the conductor of the coil from the holder to the at least one other holder.

公开(公告)号：US20150255205A1

公开(公告)日：2015-09-10

申请号：US14203289

申请日：2014-03-10

Applicant: QUALCOMM INCORPORATED

Inventor： Simon Peter Islinger

IPC: H01F27/26 ,  H05K5/02 ,  H01F41/04 ,  H01F38/14 ,  H01F41/00 ,  B60L11/18 ,  H02J5/00

CPC classification number: H01F27/266 ,  B60L11/182 ,  H01F38/14 ,  H01F41/005 ,  H01F41/04 ,  H02J7/025 ,  H02J50/12 ,  H02J50/40 ,  H02J50/90 ,  H05K5/0217 ,  Y10T29/4902

Abstract: Systems and methods for implementing interengagement structures for a ferrite tile assembly of an induction coil housing are described herein. One aspect of the subject matter described in the disclosure is a housing. The housing includes a base forming a receptacle. The housing further includes a ferrite tile assembly. The housing further includes an interengagement structure extending from the base and configured to secure the ferrite tile assembly relative to the base within the receptacle.

Abstract translation: 这里描述了用于实现感应线圈壳体的铁氧体瓷砖组件的相互接合结构的系统和方法。 在本公开中描述的主题的一个方面是外壳。 壳体包括形成容器的基座。 壳体还包括铁氧体瓦片组件。 壳体还包括从基部延伸并且被配置成相对于座中的基部固定铁氧体瓦片组件的相互接合结构。