公开(公告)号：US20220175258A1

公开(公告)日：2022-06-09

申请号：US17247323

申请日：2020-12-07

Applicant: QUALCOMM Incorporated

Inventor： Jack Conway KITCHENS ,  John Keith SCHNEIDER ,  Evan Michael BRELOFF ,  Emily Kathryn BROOKS ,  Stephen Michael GOJEVIC ,  Fitzgerald JOHN ARCHIBALD ,  Alexei STOIANOV ,  Shounak Uday GORE ,  Nicholas Ian BUCHAN

IPC: A61B5/021 ,  A61B5/00

Abstract: Some disclosed methods involve controlling, via a control system, a light source system to emit a plurality of light pulses into biological tissue at a pulse repetition frequency, the biological tissue including blood and blood vessels at depths within the biological tissue. Such methods may involve receiving, by the control system, signals from the piezoelectric receiver corresponding to acoustic waves emitted from portions of the biological tissue, the acoustic waves corresponding to photoacoustic emissions from the blood and the blood vessels caused by the plurality of light pulses. Such methods may involve detecting, by the control system, heart rate waveforms in the signals, determining, by the control system, a first subset of detected heart rate waveforms corresponding to vein heart rate waveforms and determining, by the control system, a second subset of detected heart rate waveforms corresponding to artery heart rate waveforms.

公开(公告)号：US20210004555A1

公开(公告)日：2021-01-07

申请号：US16502962

申请日：2019-07-03

Applicant: QUALCOMM Incorporated

Inventor： Hrishikesh Vijaykumar PANCHAWAGH ,  Nicholas Ian BUCHAN ,  Kostadin Dimitrov DJORDJEV

IPC: G06K9/00 ,  G06F3/041 ,  H01L41/047 ,  H01L41/113

Abstract: Techniques described herein address these and other issues by providing an under-display sensor capable of providing fingerprint scanning over an entire display using optical and/or ultrasonic means. To do so, the sensor comprises an array of pixels, where each can pixel comprises a piezoelectric sensor element and a diode capable of being used as a photodetector during a light-sensing mode, and as a peak detector during a pressure-sensing mode. The sensor may further comprise a piezoelectric layer and one or more electrodes, which can generate a pressure wave during the pressure sensing mode.

公开(公告)号：US20210377670A1

公开(公告)日：2021-12-02

申请号：US17302714

申请日：2021-05-11

Applicant: QUALCOMM Incorporated

Inventor： Jessica Liu STROHMANN ,  Hrishikesh Vijaykumar PANCHAWAGH ,  Nicholas Ian BUCHAN ,  Yipeng LU ,  Kostadin Dimitrov DJORDJEV

IPC: H04R17/00 ,  B06B1/06 ,  H01L41/193 ,  H04R17/02 ,  H04R1/02

Abstract: A mobile device includes one or more piezoelectric polymer layers underlying a display. The one or more piezoelectric polymer layers may be electrically driven to operate in either a d33 stretching mode or a d31 bending mode. The mobile device functions as an ultrasonic sensor in the d33 stretching mode and as an audio speaker/microphone or a proximity sensor in the d31 bending mode. The piezoelectric polymer layer operating in the d31 bending mode may be directly mechanically coupled to a display, indirectly mechanically coupled to the display and underlying an ultrasonic sensor stack, or integrated in the ultrasonic sensor stack. Signal performance of the piezoelectric polymer layer operating in the d31 bending mode may be enhanced or modulated by having a larger area, multiple layers, bi-pole or uni-pole driving with multiple layers, one or more stiff adhesives, a spacer layer, one or more mass features, a thin TFT layer, a thick piezoelectric polymer layer, or combinations thereof.

公开(公告)号：US20200066964A1

公开(公告)日：2020-02-27

申请号：US16666288

申请日：2019-10-28

Applicant: QUALCOMM Incorporated

Inventor： Jon Gregory ADAY ,  Hong Bok WE ,  Steve Joseph BEZUK ,  Nicholas Ian BUCHAN

IPC: H01L41/113 ,  H01L21/768 ,  H01L21/56 ,  H01L23/00 ,  H01L21/78 ,  H01L23/31 ,  H01L23/498 ,  H01L41/053

Abstract: A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.

公开(公告)号：US20170323926A1

公开(公告)日：2017-11-09

申请号：US15256501

申请日：2016-09-02

Applicant: QUALCOMM Incorporated

Inventor： Jon Gregory ADAY ,  Hong Bok WE ,  Steve Joseph BEZUK ,  Nicholas Ian BUCHAN

IPC: H01L27/20 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/78 ,  H01L21/768 ,  H01L41/113

Abstract: A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.