公开(公告)号：US20200066964A1

公开(公告)日：2020-02-27

申请号：US16666288

申请日：2019-10-28

Applicant: QUALCOMM Incorporated

Inventor： Jon Gregory ADAY ,  Hong Bok WE ,  Steve Joseph BEZUK ,  Nicholas Ian BUCHAN

IPC: H01L41/113 ,  H01L21/768 ,  H01L21/56 ,  H01L23/00 ,  H01L21/78 ,  H01L23/31 ,  H01L23/498 ,  H01L41/053

Abstract: A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.

公开(公告)号：US20170323926A1

公开(公告)日：2017-11-09

申请号：US15256501

申请日：2016-09-02

Applicant: QUALCOMM Incorporated

Inventor： Jon Gregory ADAY ,  Hong Bok WE ,  Steve Joseph BEZUK ,  Nicholas Ian BUCHAN

IPC: H01L27/20 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/78 ,  H01L21/768 ,  H01L41/113

Abstract: A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.