公开(公告)号：US20160033975A1

公开(公告)日：2016-02-04

申请号：US14446258

申请日：2014-07-29

Applicant: QUALCOMM INCORPORATED

Inventor： RAJAT MITTAL ,  HEE JUN PARK ,  YOUNG HOON KANG

IPC: G05D23/19 ,  G05B13/02

CPC classification number: G05D23/1917 ,  G05B13/0205 ,  G06F1/206 ,  G06F1/3206 ,  H01L23/34 ,  H01L23/38 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/072 ,  H01L2924/0002 ,  Y02D10/16 ,  H01L2924/00

Abstract: Systems, methods, and computer programs are disclosed for reducing leakage power of a system on chip (SoC). One such method comprises monitoring a plurality of temperature differentials across a respective plurality of thermoelectric coolers on a system on chip (SoC). Each of the thermoelectric coolers is dedicated to a corresponding one of a plurality of chip sections on the SoC. The thermoelectric coolers are controlled based on the plurality of temperature differentials to minimize a sum of a combined power consumption of the plurality of chip sections and the plurality of corresponding dedicated thermoelectric coolers.

Abstract translation: 公开了用于降低片上系统（SoC）的泄漏功率的系统，方法和计算机程序。 一种这样的方法包括监视片上系统（SoC）上的相应多个热电冷却器上的多个温差。 每个热电冷却器专用于SoC上的多个芯片部分中的相应的一个。 基于多个温差来控制热电冷却器，以将多个芯片部分和多个相应的专用热电冷却器的组合功耗的总和最小化。