公开(公告)号：US20150286257A1

公开(公告)日：2015-10-08

申请号：US14280631

申请日：2014-05-18

Applicant: QUALCOMM INCORPORATED

Inventor： HEE JUN PARK ,  YOUNG HOON KANG ,  RONALD FRANK ALTON ,  CHRISTOPHER LEE MEDRANO ,  JON JAMES ANDERSON

IPC: G06F1/20

CPC classification number: G05D23/1917 ,  G05B15/02 ,  G06F1/203 ,  G06F1/206 ,  G06F1/26 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F11/30 ,  G06F11/34 ,  Y02D10/16

Abstract: Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.

公开(公告)号：US20150286225A1

公开(公告)日：2015-10-08

申请号：US14280630

申请日：2014-05-18

Applicant: QUALCOMM INCORPORATED

Inventor： HEE JUN PARK ,  YOUNG HOON KANG ,  RONALD FRANK ALTON ,  CHRISTOPHER LEE MEDRANO ,  JON JAMES ANDERSON

IPC: G05D23/19 ,  G05B15/02

CPC classification number: G05D23/1917 ,  G05B15/02 ,  G06F1/203 ,  G06F1/206 ,  G06F1/26 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F11/30 ,  G06F11/34 ,  Y02D10/16

Abstract: Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.

公开(公告)号：US20150286262A1

公开(公告)日：2015-10-08

申请号：US14280629

申请日：2014-05-18

Applicant: QUALCOMM INCORPORATED

Inventor： HEE JUN PARK ,  YOUNG HOON KANG ,  RONALD FRANK ALTON ,  CHRISTOPER LEE MEDRANO ,  JON JAMES ANDERSON

IPC: G06F1/32

CPC classification number: G05D23/1917 ,  G05B15/02 ,  G06F1/203 ,  G06F1/206 ,  G06F1/26 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F11/30 ,  G06F11/34 ,  Y02D10/16

Abstract: Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.

Abstract translation: 公开了在包含芯片上的异构多处理器系统（“SoC”）的便携式计算设备中的用于能量效率感知热管理的方法和系统的各种实施例。 由于异构多处理器SoC中的单独处理组件可能在给定温度下可能表现出不同的处理效率，因此可以利用能源效率感知热管理技术来比较其测量工作温度下各个处理组件的性能数据，从而优化服务质量 （“QoS”），通过调整电力供应，重新分配工作量远离或转移最低能效处理组件的功率模式。 以这些方式，该解决方案的实施例优化了跨SoC消耗的平均功耗量以处理MIPS的工作负载。

公开(公告)号：US20150277395A1

公开(公告)日：2015-10-01

申请号：US14289675

申请日：2014-05-29

Applicant: QUALCOMM INCORPORATED

Inventor： VIJAY RAMAN ,  AMY DERBYSHIRE ,  CHRISTOPHER LEE MEDRANO ,  SHIJU ABRAHAM MATHEW ,  RONALD FRANK ALTON ,  JON JAMES ANDERSON

IPC: G05B11/42

CPC classification number: G05B11/42 ,  G06F1/203 ,  G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3296 ,  H01L23/34 ,  H01L23/345 ,  Y02D10/126

Abstract: A temperature of a component within the portable computing device (PCD) may be monitored along with a parameter associated with the temperature. The parameter associated with temperature may be an operating frequency, transmission power, or a data flow rate. It is determined if the temperature has exceeded a threshold value. If the temperature has exceeded the threshold value, then the temperature is compared with a temperature set point and a first error value is then calculated based on the comparison. Next, a first optimum value of the parameter is determined based on the first error value. If the temperature is below or equal to the threshold value, then a present value of the parameter is compared with a desired threshold for the parameter and a second error value is calculated based on the comparison. A second optimum value of the parameter may be determined based on the second error value.

Abstract translation: 便携式计算设备（PCD）内的组件的温度可以与伴随温度的参数一起被监控。 与温度相关的参数可以是工作频率，发射功率或数据流速。 确定温度是否超过阈值。 如果温度超过阈值，则将温度与温度设定值进行比较，然后根据比较计算第一误差值。 接下来，基于第一误差值来确定参数的第一最佳值。 如果温度低于或等于阈值，则将参数的当前值与参数的期望阈值进行比较，并且基于该比较来计算第二误差值。 可以基于第二误差值来确定参数的第二最佳值。